Manufacturer Part Number
XC7A75T-2CSG324I
Manufacturer
Xilinx
Introduction
The XC7A75T-2CSG324I is part of Xilinx's Artix-7 series of Embedded FPGAs, designed for optimal power efficiency and high performance in a compact form factor.
Product Features and Performance
Advanced 28nm technology for improved performance and lower power consumption.
Features 5900 Logic Blocks/Configurable Logic Blocks for flexible design implementation.
Provides 75,520 Logic Elements/Cells for complex digital circuit integration.
Offers 3,870,720 Total RAM Bits for extensive data storage and manipulation.
Equipped with 210 Input/Output pins for comprehensive external interfacing.
Supports a supply voltage range of 0.95V to 1.05V, ideal for low power applications.
Capable of operating in harsh conditions with a temperature range of -40°C to 100°C.
Product Advantages
High logic and memory resource count in a small package enhances system integration.
Low power consumption is ideal for portable and battery-operated devices.
Robust temperature range supports operation in extreme environments.
Surface mount package facilitates compact and efficient PCB design.
Key Technical Parameters
Number of LABs/CLBs: 5900
Number of Logic Elements/Cells: 75520
Total RAM Bits: 3870720
Number of I/O: 210
Voltage Supply: 0.95V ~ 1.05V
Operating Temperature: -40°C ~ 100°C (TJ)
Package: 324-LFBGA, CSPBGA
Quality and Safety Features
Built using reliable 28nm process technology.
Robust against harsh environmental conditions.
Compliant with industry-standard quality and safety norms.
Compatibility
Compatible with a wide range of digital and analog input/output standards.
Flexible interfacing capabilities for easy integration into existing systems.
Application Areas
Ideal for Telecommunications, Industrial, Automotive, and Consumer Electronics applications.
Suitable for high-performance computing, sensor interfacing, and embedded control systems.
Product Lifecycle
Current status: Active
Not nearing discontinuation, ensuring long-term availability.
Future replacements or upgrades may follow as technology progresses.
Several Key Reasons to Choose This Product
High-density integration capabilities improve performance while reducing system size and cost.
Low operational power requirement extends the battery life of portable devices.
Wide operating temperature range makes it suitable for outdoor and industrial applications.
Compact surface mount package allows for more efficient PCB design layouts.
Active product status with Xilinx's commitment to longevity and support.
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