Manufacturer Part Number
XC7A200T-3SBG484E
Manufacturer
Xilinx
Introduction
The XC7A200T-3SBG484E is part of Xilinx's Artix-7 series, designed for efficiency and performance in embedded FPGA applications.
Product Features and Performance
It features 16825 LABs/CLBs, offering robust logic processing capabilities.
With 215360 Logic Elements/Cells, it supports complex digital computations.
The device has a total of 13455360 RAM bits, facilitating substantial data storage and manipulation.
Offers 285 I/O pins for versatile connectivity options.
It operates on a supply voltage range of 0.95V ~ 1.05V, optimizing power efficiency.
Designed for surface mount technology, easing the integration process.
Operates within a temperature range of 0°C ~ 100°C (TJ), suitable for a wide range of environments.
Product Advantages
High logic and RAM capacity enable handling of intensive applications.
Low power consumption enhances system efficiency and reliability.
Wide operating temperature range ensures performance stability under varying conditions.
Key Technical Parameters
Number of LABs/CLBs: 16825
Logic Elements/Cells: 215360
Total RAM Bits: 13455360
Number of I/O: 285
Voltage Supply: 0.95V ~ 1.05V
Operating Temperature: 0°C ~ 100°C (TJ)
Quality and Safety Features
Adheres to stringent quality standards for reliability.
Built-in safety features to protect against operational hazards.
Compatibility
Compatible with various design tools and software provided by Xilinx.
Can be integrated into a wide range of circuits thanks to its surface mount package and electrical characteristics.
Application Areas
Ideal for embedded systems, telecommunications, automotive applications, and more.
Suited for digital signal processing, machine learning tasks, and industrial applications.
Product Lifecycle
Currently marked as Active, indicating availability and ongoing support.
Not nearing discontinuation, ensuring long-term availability and support for new designs.
Several Key Reasons to Choose This Product
High logic and memory capacity for demanding applications.
Power efficiency contributes to lower overall system power consumption.
Versatile I/O options enable connectivity with a wide array of external devices.
Robust temperature range supports deployment in diverse environments.
Long product lifecycle ensures future availability and support.
Backed by Xilinx, a leader in FPGA technology, ensuring cutting-edge features and reliability.
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