XC7A200T-1FBG676C - AMD

Manufacturer Part Number

XC7A200T-1FBG676C

Manufacturer

Xilinx

Introduction

The XC7A200T-1FBG676C is a Field Programmable Gate Array (FPGA) from Xilinx's Artix-7 series, designed for optimal power efficiency and high-performance processing in embedded systems.

Product Features and Performance

Provides 215,360 logic cells and 16,825 configurable logic blocks (CLBs)

Equipped with 13,455,360 total RAM bits for extensive data management

Features 400 I/O pins for broad connectivity options

Operates with a voltage supply between 0.95V and 1.05V

Supports a surface mount 676-FCBGA (27x27) package enhancing the compact design

Handles a temperature range from 0°C to 85°C ensuring stable operation in various environments

Designed for Tray packaging to facilitate efficient logistics and handling

Product Advantages

High logic cell count facilitates complex design implementation

Ample RAM and I/O options enhance multitasking and interfacing abilities

Low power consumption and broad temperature endurance increase reliability and durability

Key Technical Parameters

Number of LABs/CLBs: 16825

Number of Logic Elements/Cells: 215360

Total RAM Bits: 13455360

Number of I/O: 400

Voltage Supply: 0.95V ~ 1.05V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Rigorously tested for stability and reliability under a range of electrical and environmental conditions

Constructed in accordance with industry-leading quality standards

Compatibility

Compatible with standard surface-mount technology equipment and PCB designs according to its 676-FCBGA package specifications

Application Areas

Suitable for high-performance computing, medical imaging, aerospace, and defense systems, particularly where low power and high processing capabilities are crucial

Product Lifecycle

Status: Active

No current indication of discontinuation, ensuring product longevity and support

Upgrades or replacements are available within the Artix-7 series

Several Key Reasons to Choose This Product

High integration capability enhances system complexity without the need for multiple chips

Energy-efficient design supports eco-friendly applications and reduces operational costs

Extensive input/output provisioning streamlines connectivity and expands the applications range

Diverse operational temperature range ensures adaptability in various environmental conditions

Reliable product continuity with Xilinx's continued support and supply stability