XC6VLX760-2FFG1760C - AMD

Manufacturer Part Number

XC6VLX760-2FFG1760C

Manufacturer

AMD Xilinx

Introduction

Advanced high-performance FPGA chip for embedded systems

Integrates powerful logic, memory, and connectivity resources

Product Features and Performance

758,784 logic cells for implementing complex digital designs

26,542,080 total RAM bits for flexible on-chip storage

1,200 user I/O pins for high-bandwidth connectivity

Supports operating temperatures from 0°C to 85°C

Product Advantages

Programmable logic enables flexible and adaptable designs

High-density logic and memory resources for complex functionality

Wide range of I/O options for diverse connectivity requirements

Extended temperature range supports rugged applications

Key Technical Parameters

Base Product Number: XC6VLX760

Package/Case: 1760-BBGA, FCBGA

Mounting Type: Surface Mount

Series: Virtex-6 LXT

Supply Voltage: 0.95V ~ 1.05V

Quality and Safety Features

RoHS3 compliant for environmental responsibility

Manufacturer's packaging: 1760-FCBGA (42.5x42.5)

Compatibility

Compatible with a wide range of embedded and industrial systems

Application Areas

Suitable for various industrial, medical, and military applications

Ideal for implementing complex digital designs in embedded systems

Product Lifecycle

Current model, no discontinuation planned

Upgrades and replacements available from AMD Xilinx

Key Reasons to Choose This Product

Powerful logic and memory resources for advanced functionality

Wide range of I/O options for flexible connectivity

Rugged operating temperature range for demanding environments

Programmable nature allows for customized and adaptable designs

RoHS3 compliance for environmental sustainability