Manufacturer Part Number
XC6SLX75-2FGG676I
Manufacturer
Xilinx
Introduction
The XC6SLX75-2FGG676I is a high-performance FPGA from the Spartan®-6 LX series, designed for embedded systems development with an advanced set of features.
Product Features and Performance
Integrated with 74,637 logic elements and 5,831 LABs/CLBs for sophisticated digital logic processes
Offers 3,170,304 total RAM bits for extensive data handling capabilities
Equipped with 408 input/output pins for comprehensive peripheral interfacing
Operates over a supply voltage range of 1.14V to 1.26V
Features a surface mount BGA package for secure PCB mounting
Product Advantages
High logic and memory resources support complex programmable capabilities
Broad range of I/O enhances connectivity and flexibility in system design
Robust thermal tolerance from -40°C to 100°C enables use in extreme environments
Key Technical Parameters
Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 408
Voltage Supply: 1.14V ~ 1.26V
Operating Temperature: -40°C ~ 100°C (TJ)
Quality and Safety Features
Manufactured to stringent standards to ensure high reliability and functionality in critical applications
Enhanced with safety features suited for high-temperature operations
Compatibility
Compatible with standard surface mount technology and board hardware ensuring ease of integration into existing setups
Application Areas
Ideal for telecommunications, automotive, consumer electronics, and aerospace industries requiring high-level digital processing
Product Lifecycle
Currently in active production with no near-term discontinuation expected, maintaining availability for future projects
Upgrade and replacement options are typically available within the Spartan-6 product family
Several Key Reasons to Choose This Product
Exceptional processing power with advanced logic and memory configurations for high-demand applications
Versatile connectivity options with a high number of I/Os enabling flexible system design and expansion
Durable construction and wide operating temperature range suit a broad array of deployment environments
Continued manufacturer support and product availability mitigate the risks related to obsolescence