Manufacturer Part Number
XC6SLX100-3FGG676I
Manufacturer
AMD Xilinx
Introduction
High-performance, low-power FPGA
Ideal for a wide range of applications, including industrial, medical, and communications
Product Features and Performance
101,261 logic elements/cells
4,939,776 total RAM bits
7,911 logic blocks (LABs/CLBs)
High-speed DDR3 memory interface
Advanced DSP capabilities
Embedded RISC processor cores
Low power consumption
Product Advantages
Flexible and reconfigurable design
High performance and efficiency
Low power operation
Extensive feature set and resources
Key Technical Parameters
Package: 676-FBGA (27x27)
Mounting Type: Surface Mount
Operating Temperature: -40°C to 100°C
Supply Voltage: 1.14V to 1.26V
Number of I/O: 480
Quality and Safety Features
RoHS3 compliant
Rigorous quality control and testing
Compatibility
Compatible with a range of Xilinx development tools and software
Application Areas
Industrial automation and control
Medical imaging and equipment
Communications and networking
Military and aerospace systems
Product Lifecycle
Currently in production
Replacement and upgrade options available
Key Reasons to Choose This Product
High performance and flexibility
Extensive feature set and resources
Low power consumption
Robust quality and safety features
Broad compatibility and ecosystem support
XC6SLX100-3FG676IXILINX
XC6SLX100-N3FG484I
XC6SLX100-L1FGG676IXilinxIC FPGA 480 I/O 676FBGA