XC5VSX35T-2FFG665I - AMD

Manufacturer Part Number

XC5VSX35T-2FFG665I

Manufacturer

Xilinx

Introduction

This model belongs to the Virtex®-5 SXT series, a line of high-performance Embedded FPGAs designed for advanced systems requiring significant processing capability and I/O flexibility.

Product Features and Performance

Embedded FPGA (Field Programmable Gate Array) technology

High-density integration with 34,816 Logic Elements/Cells

Features 2,720 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs)

Provides 3,096,576 Total RAM Bits for extensive data storage and manipulation

Supports 360 I/O pins for flexible connectivity and interfacing

Engineered for surface mount applications with a 665-FCBGA (27x27) package

Operates across a voltage supply range of 0.95V to 1.05V

Product Advantages

Offers a balance between high performance and power efficiency

Versatile I/O and high logic capacity cater to complex, multiple-function systems

The thermally efficient package supports operation in extreme conditions from -40°C to 100°C

Key Technical Parameters

Number of LABs/CLBs: 2720

Number of Logic Elements/Cells: 34,816

Total RAM Bits: 3,096,576

Number of I/O: 360

Voltage Supply: 0.95V ~ 1.05V

Operating Temperature: -40°C ~ 100°C (TJ)

Quality and Safety Features

Engineered to maximize thermal and electrical efficiency, ensuring reliability in varied environments

Complies with industry-standard quality and safety protocols

Compatibility

Designed for broad compatibility with leading-edge design and development tools

Application Areas

Ideal for advanced telecommunications, networking systems, and aerospace applications

Suitable for complex digital signal processing (DSP) and system-on-chip (SoC) integrations

Product Lifecycle

Currently active and not nearing discontinuation

Xilinx provides ongoing support with replacements and upgrades available

Several Key Reasons to Choose This Product

State-of-the-art FPGA technology from a leading manufacturer, Xilinx

Exceptional balance of performance, power, and flexibility for demanding applications

Comprehensive support throughout the product lifecycle, including future upgrades

Robust design capable of operating in extreme temperatures and diverse conditions

Advanced integration capability supports both current and next-gen system developments