Manufacturer Part Number
XC3S700A-4FGG400I
Manufacturer
Xilinx
Introduction
The XC3S700A-4FGG400I is a high-performance FPGA from Xilinx's Spartan-3A series designed for embedded processing applications.
Product Features and Performance
Embedded FPGA for programmable logic solutions
1472 Logic Array Blocks / Configurable Logic Blocks
13248 Logic Elements / Cells for complex digital circuits
368640 Total RAM bits for data storage
311 I/O pins for interfacing with other components
700000-gate capacity for extensive programmability
Surface mount 400-BGA package fitting for dense PCB layouts
Product Advantages
Tailored for high-density and high-performance applications
Broad operating temperature range (-40°C to 100°C) for reliability in extreme conditions
Supports multiple voltage supply configurations for flexible power design
Key Technical Parameters
Number of LABs/CLBs: 1472
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 311
Number of Gates: 700000
Voltage Supply: 1.14V to 1.26V
Operating Temperature: -40°C to 100°C (TJ)
Quality and Safety Features
Robust thermal performance over a wide operating temperature range
Compliant with industry safety and quality standards
Compatibility
The 400-BGA package is compatible with surface mount technology, allowing integration with modern PCB designs.
Application Areas
Industrial automation
Automotive electronics
Consumer electronics
Telecommunications
Defense and aerospace
Product Lifecycle
The product status is last-time-buy due to evolving technology and newer generation FPGAs.
Information about upcoming discontinuations, replacements, or upgrades should be confirmed directly with Xilinx or an authorized distributor.
Several Key Reasons to Choose This Product
Offers a versatile and programmable solution that can be tailored to meet specific application needs.
High logic and RAM capacity enables the handling of complex algorithms and processes.
Wide operating temperature range ensures the device can operate reliably in harsh environments.
Backed by Xilinx's reputation for producing industry-leading FPGAs.
Surface mount package supports compact design footprints.
Despite the last-time-buy status, it could be an optimal choice for designs nearing production, or for sustaining existing applications with extensive qualification requirements.
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