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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC3S500E-4FTG256C
AMD
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See specifications for product details.

XC3S500E-4FTG256C - AMD

Manufacturer Part Number
XC3S500E-4FTG256C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC3S500E-4FTG256C
ECAD Model
Parts Description
IC FPGA 190 I/O 256FTBGA
Detailed Description
Package
256-LBGA
Data sheet
XC3S500E-4FTG256C.pdf
RoHs Status
ROHS3 Compliant
In stock: 398

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Quantity

Specifications

XC3S500E-4FTG256C Tech Specifications
AMD - XC3S500E-4FTG256C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3S500E-4FTG256C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 1.14V ~ 1.26V  
Total RAM Bits 368640  
Supplier Device Package 256-FTBGA (17x17)  
Series Spartan®-3E  
Package / Case 256-LBGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 10476  
Number of LABs/CLBs 1164  
Number of I/O 190  
Number of Gates 500000  
Mounting Type Surface Mount  
Base Product Number XC3S500  

Parts Introduction

Manufacturer Part Number

XC3S500E-4FTG256C

Manufacturer

Xilinx

Introduction

Spartan-3E FPGA for high-performance logic solutions

Product Features and Performance

High-density, low-cost FPGA solution

10476 logic cells providing ample design flexibility

1164 configurable logic blocks (CLBs) for complex logic creation

368640 total RAM bits for efficient data storage operations

500K system gates for intricate digital system development

190 user I/O pins for versatile peripheral connections

Product Advantages

Optimized for cost-sensitive applications

Proven Spartan-3E architecture for reliability

Low power consumption for power-sensitive designs

Key Technical Parameters

500000 system gates

10476 logic elements/cells

1164 LABs/CLBs

368640 RAM bits

190 I/O pins

Voltage supply range of 1.14V to 1.26V

0°C to 85°C operating temperature range

Quality and Safety Features

Compliance with RoHS and industry quality standards

Robust surface-mount 256-LBGA packaging for secure PCB mounting

Compatibility

Supports industry-standard design tools for integration and development

Compatible with various peripheral components due to flexible I/O standards

Application Areas

Ideal for consumer electronics, automotive, telecommunications, and industrial control systems

Product Lifecycle

Last Time Buy status indicates nearing discontinuation

Potential future availability of replacement or upgrade paths

Several Key Reasons to Choose This Product

High integration capability for complex system designs on a single chip

Efficient power usage for extended battery life in portable devices

Robust design for longevity and durability in various environments

Large community and support due to widespread use of Xilinx FPGAs

Cost-effective option for mass production in consumer markets

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3S500E-4FTG256C

Product Attribute XC3S500E-4FTG256C XC3S500E-4FT256C XC3S500E-4FGG320C XC3S500E-4CPG132C
Part Number XC3S500E-4FTG256C XC3S500E-4FT256C XC3S500E-4FGG320C XC3S500E-4CPG132C
Manufacturer AMD AMD AMD AMD
Number of Gates 500000 500000 500000 500000
Number of LABs/CLBs 1164 1164 1164 1164
Number of Logic Elements/Cells 10476 10476 10476 10476
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Base Product Number XC3S500 XC3S500 XC3S500 XC3S500
Package / Case 256-LBGA 256-LBGA 320-BGA 132-TFBGA, CSPBGA
Total RAM Bits 368640 368640 368640 368640
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Series Spartan®-3E Spartan®-3E Spartan®-3E Spartan®-3E
Package Tray Bulk Tray Tray
Number of I/O 190 190 232 92
Supplier Device Package 256-FTBGA (17x17) 256-FTBGA (17x17) 320-FBGA (19x19) 132-CSPBGA (8x8)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount

XC3S500E-4FTG256C Datasheet PDF

Download XC3S500E-4FTG256C pdf datasheets and AMD documentation for XC3S500E-4FTG256C - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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AMD

XC3S500E-4FTG256C

AMD
32D-XC3S500E-4FTG256C

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