Manufacturer Part Number
XC3S5000-4FGG900C
Manufacturer
Xilinx
Introduction
The XC3S5000-4FGG900C is a high-performance FPGA from Xilinx's Spartan-3 series, designed for embedded applications requiring a high number of logic cells and I/O options.
Product Features and Performance
Integrated with 74,880 logic elements and 8,320 LABs/CLBs for flexible and complex logic implementation
Features 1,916,928 total RAM bits for extensive data storage and manipulation
Provides 633 I/O pins for versatile connectivity options
Supports a wide voltage supply range from 1.14V to 1.26V for operational flexibility
Operates within a temperature range of 0°C to 85°C, suitable for various environmental conditions
Product Advantages
High logic capacity and RAM support complex and demanding applications
Large number of I/O options enable extensive connectivity and interface capabilities
Low voltage operation for energy-efficient designs
Robust temperature range enhances reliability in diverse operating conditions
Key Technical Parameters
Number of LABs/CLBs: 8320
Number of Logic Elements/Cells: 74880
Total RAM Bits: 1,916,928
Number of I/O: 633
Number of Gates: 5,000,000
Voltage Supply: 1.14V ~ 1.26V
Operating Temperature: 0°C ~ 85°C (TJ)
Quality and Safety Features
Manufactured by Xilinx, a leader in FPGA technology ensuring high quality and reliability
Compliant with standard safety and quality protocols for electronic components
Compatibility
Compatible with a wide range of design tools from Xilinx for ease of development and programming
Supporting surface mount technology for simplified PCB design and manufacturing processes
Application Areas
Ideal for demanding applications in telecommunications, automotive, industrial control systems, and consumer electronics
Product Lifecycle
Currently in the Last Time Buy phase, suggesting that it is nearing discontinuation
Potential customers are urged to consider future availability of replacements or upgrades for long-term projects
Several Key Reasons to Choose This Product
High logic and RAM capacity cater to advanced and complex embedded system designs
Extensive I/O options provide flexibility in interfacing with other components and systems
Supported by Xilinx's comprehensive design tools for ease of development
Surface mount compatibility aids in modern, compact PCB designs
Vast application potential across various industries due to its robust features and performance