XC3S50-4TQ144C - AMD

Manufacturer Part Number

XC3S50-4TQ144C

Manufacturer

Xilinx

Introduction

The XC3S50-4TQ144C is part of the Spartan-3 series from Xilinx, tailored for high performance in embedded FPGA applications.

Product Features and Performance

Contains 192 LABs/CLBs

Includes 1728 logic elements/cells

Offers 73728 total RAM bits

Provides 97 I/O pins

Features a gate count of 50000

Supports a voltage supply range from 1.14V to 1.26V

Utilizes surface mount technology

Operational temperature range from 0°C to 85°C

Enclosed in a 144-LQFP package

Uses 144-TQFP (20x20) supplier device package

Product Advantages

Compact and efficient 144-pin package

High number of logic elements and configurable logic blocks for versatile applications

Ample I/O pins facilitate extensive interfacing

Increased RAM capacity ensures adequate memory for complex designs

Key Technical Parameters

Number of LABs/CLBs: 192

Number of Logic Elements/Cells: 1728

Total RAM Bits: 73728

Number of I/O: 97

Voltage Supply: 1.14V ~ 1.26V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Robust operation within specified temperature and voltage ranges

Reliable performance backed by Xilinx reputation

Packaged securely in industry-standard LQFP

Compatibility

Suitable for use in multiple standard surface mount setups

Easily integrated into existing systems due to common 20x20 TQFP footprint

Application Areas

Suitable for embedded processing

Ideal for telecommunications

Effective for consumer electronics

Applicable in automotive applications

Product Lifecycle

Currently marked as Last Time Buy

Replacement or future upgrades should be considered as this model is nearing discontinuation

Several Key Reasons to Choose This Product

High integration capability due to a large number of configurable logic blocks and logic cells

Extensive memory resources accommodate more complex algorithms and designs

Suitable for varied voltage operations ensuring adaptability in power-supplied environments

Broad operating temperature range enables use in diverse environmental conditions

Future-proof design with outlined replacement options as the product nears its end of lifecycle