XC3S400AN-4FGG400C - AMD

Manufacturer Part Number

XC3S400AN-4FGG400C

Manufacturer

Xilinx

Introduction

Spartan-3AN FPGA, suitable for a range of embedded processing applications with high-density logic, memory and I/O capabilities

Product Features and Performance

Large number of LABs/CLBs: 896

High logic capacity: 8064 Logic Elements/Cells

Ample RAM: 368640 Total RAM Bits

Rich I/O options: 311 I/O pins

High gate count: 400,000 gates

Fine voltage supply range: 1.14V - 1.26V

Surface Mount Package for compact designs

Standard operating temperature range: 0°C - 85°C

Product Advantages

Integrates non-volatile storage on-chip

Supports advanced security features including AES encryption and device DNA protection

Beneficial for power-sensitive applications with low voltage requirements

Key Technical Parameters

Number of LABs/CLBs: 896

Number of Logic Elements/Cells: 8064

Total RAM Bits: 368640

Number of I/O: 311

Number of Gates: 400000

Voltage - Supply: 1.14V ~ 1.26V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

High-reliability design suitable for industrial applications

Compatibility

Standard 400-BGA packaging compatible with common surface mount processes

Use with Spartan-3 generation toolsets and development environments

Application Areas

Consumer Electronics

Telecommunications

Automotive Industries

Industrial Controls

Medical Devices

Product Lifecycle

Status: Last Time Buy

Availability of replacements or upgrades: Check for latest Spartan FPGA family members

Several Key Reasons to Choose This Product

High integration of logic, memory, and I/O capabilities in one chip

Last Time Buy status, ideal for final production runs

Xilinx's reputation for rugged and reliable FPGA devices

Spartan-3AN series known for its superior non-volatile capabilities

Optimal choice for both prototyping and full-scale production requirements

Suitable for diverse applications from simple glue logic to complex system-on-chip designs