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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC3S1600E-4FGG400C
XC3S1600E-4FGG400C Image
Image may be representation.
See specifications for product details.

XC3S1600E-4FGG400C - AMD

Manufacturer Part Number
XC3S1600E-4FGG400C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC3S1600E-4FGG400C
ECAD Model
Parts Description
IC FPGA 304 I/O 400FBGA
Detailed Description
Package
400-BGA
Data sheet
XC3S1600E-4FGG400C.pdf
RoHs Status
ROHS3 Compliant
In stock: 125

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Quantity

Specifications

XC3S1600E-4FGG400C Tech Specifications
AMD - XC3S1600E-4FGG400C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC3S1600E-4FGG400C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 1.14V ~ 1.26V  
Total RAM Bits 663552  
Supplier Device Package 400-FBGA (21x21)  
Series Spartan®-3E  
Package / Case 400-BGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 33192  
Number of LABs/CLBs 3688  
Number of I/O 304  
Number of Gates 1600000  
Mounting Type Surface Mount  
Base Product Number XC3S1600  

Parts Introduction

Manufacturer Part Number

XC3S1600E-4FGG400C

Manufacturer

Xilinx

Introduction

The XC3S1600E-4FGG400C is a Spartan®-3E series FPGA designed for high-performance applications in embedded systems.

Product Features and Performance

Functions as an FPGA (Field Programmable Gate Array)

Features 3688 LABs/CLBs and 33192 Logic Elements/Cells

Total RAM Bits of 663552

Integrated with 304 I/O pins

Supported by 1.6 Million Gates

Product Advantages

Offers flexibility in hardware configuration

High logic cell count enhances processing capability

Substantial I/O count suitable for complex interfacing

Optimized power supply rating ensures stable operation

Key Technical Parameters

Voltage Supply: 1.14V ~ 1.26V

Operating Temperature: 0°C ~ 85°C (TJ)

Package/Case: 400-BGA

Mounting Type: Surface Mount

Quality and Safety Features

Robust surface mount 400-BGA packaging

Compliant with industry standards for temperature and voltage safeguards

Compatibility

Suitable for integration with various systems owing to standard FPGA interface and common operating parameters

Application Areas

Ideal for embedded system applications within communication, automotive, industrial automation, and consumer electronics sectors.

Product Lifecycle

Status: Last Time Buy

Product nearing discontinuation with advised to secure purchases or explore replacements and upgrades

Several Key Reasons to Choose This Product

Flexible design applications due to high count of logic cells

Enhanced connectivity options with 304 I/O pins

Stable performance ensured by controlled voltage supply parameters

Suitable operating temperature range caters to various environments

Pending product discontinuation emphasizes need for urgent procurement for long-term projects

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC3S1600E-4FGG400C

Product Attribute XC3S1600E-4FGG400C XC3S1600E-4FG400C XC3S1600E-4FG320C XC3S1600E-4FGG320C
Part Number XC3S1600E-4FGG400C XC3S1600E-4FG400C XC3S1600E-4FG320C XC3S1600E-4FGG320C
Manufacturer AMD AMD AMD AMD
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Package Tray Bulk Bulk Tray
Series Spartan®-3E Spartan®-3E Spartan®-3E Spartan®-3E
Total RAM Bits 663552 663552 663552 663552
Number of LABs/CLBs 3688 3688 3688 3688
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package 400-FBGA (21x21) 400-FBGA (21x21) 320-FBGA (19x19) 320-FBGA (19x19)
Number of Gates 1600000 1600000 1600000 1600000
Base Product Number XC3S1600 XC3S1600 XC3S1600 XC3S1600
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V 1.14V ~ 1.26V
Package / Case 400-BGA 400-BGA 320-BGA 320-BGA
Number of Logic Elements/Cells 33192 33192 33192 33192
Number of I/O 304 304 250 250

XC3S1600E-4FGG400C Datasheet PDF

Download XC3S1600E-4FGG400C pdf datasheets and AMD documentation for XC3S1600E-4FGG400C - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XC3S1600E-4FGG400C

AMD
32D-XC3S1600E-4FGG400C

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