Manufacturer Part Number
XC3S1500-4FGG676I
Manufacturer
Xilinx
Introduction
Xilinx Spartan-3 FPGA for High-Performance Embedded Systems
Product Features and Performance
High Density with 29952 Logic Elements/Cells
Large RAM Capacity of 589824 Total RAM Bits
1500000 Gates for Complex Digital Circuits
487 I/O Pins for Extensive Connectivity
Low Power Supply Voltage Range from 1.14V to 1.26V
Robust Surface Mount 676-BGA Package
Product Advantages
Designed for High Volume Production
Cost-Effective Solution for Embedded Applications
High Logic Capacity for Advanced Digital Processing
Extensive Memory Resources for Data-Intensive Operations
Proven Spartan Series Reliability and Performance
Key Technical Parameters
3328 LABs/CLBs for Logic Implementation
29952 Logic Elements/Cells
589824 Total RAM Bits for Storage
487 Number of I/O for External Communication
Voltage Supply Range: 1.14V ~ 1.26V
Operating Temperature Range: -40°C ~ 100°C (TJ)
Quality and Safety Features
High Reliability Under Extreme Temperature Conditions
Meets or Exceeds Industry Standards for Safety and Quality
Compatibility
Compatible with Various Design Tools for FPGA Development
Supports Standard BGA Board Assembly Processes
Application Areas
Ideal for Telecommunications, Automotive, Industrial, and Consumer Electronics
Product Lifecycle
Last Time Buy Status Indicating Nearing Discontinuation
Alternatives or Upgrades May be Available for New Designs
Several Key Reasons to Choose This Product
Leading-edge Spartan-3 FPGA Technology
High Integration Capable of Supporting Complex Systems
Cost-effective for Mass Production Scenarios
Optimized for Low Power Consumption
Wide Range of Applications with High I/O Count
Long-Term Reliability.DataGridViewAutoSize
XC3S1500-4FG676I/CAMD Xilinx
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