XC2VP30-6FG676C - AMD

Manufacturer Part Number

XC2VP30-6FG676C

Manufacturer

Xilinx

Introduction

High-density, programmable FPGA from Xilinx's Virtex-II Pro series optimized for high-speed signal processing and complex system integration.

Product Features and Performance

Embedded FPGA technology for reconfigurable design flexibility.

3424 Logic Blocks/CLBs for logic implementation.

30816 Logic Elements/Cells enable complex circuitry.

2506752 Total RAM Bits for high-capacity memory storage.

416 I/O pins for extensive interfacing capabilities.

Supports voltage supply range from 1.425V to 1.575V.

Surface Mount technology compatible for PCB integration.

Operates reliably within 0°C to 85°C temperature range.

Product Advantages

The Virtex-II Pro series provides massive logic capability for advanced digital designs.

Ample memory resources to handle data-intensive tasks.

Large number of I/Os for broad peripheral connectivity.

Wide-ranging voltage tolerance for flexible power supply design.

Surface mount compatibility allows for high-density board design.

Key Technical Parameters

Number of Logic Blocks/Cells: 30816

Total RAM Bits: 2506752

Number of I/O Pins: 416

Voltage Supply Range: 1.425V ~ 1.575V

Operating Temperature Range: 0°C ~ 85°C

Quality and Safety Features

Sturdy BGA packaging for reliable electrical connections.

Compliant with multiple industry-standard quality and safety norms.

Compatibility

Compatibility with standard design tools and development environments from Xilinx.

Application Areas

Telecommunications

Data Processing

Industrial Automation

Avionics

Defense Systems

Product Lifecycle

Status: Obsolete (Check for replacement models or upgraded versions)

Manufacturer may offer alternative solutions for new designs.

Several Key Reasons to Choose This Product

Proven Virtex-II Pro series technology for high-reliability and performance.

Large-scale logic and memory resources accommodate demanding applications.

High I/O count enables versatile connectivity options for system expansion.

Engineered for a variety of temperature conditions, ensuring operational stability.

Surface mount package aligns with modern high-density electronic designs.

Support and resources from Xilinx despite product obsolescence.