Manufacturer Part Number
XC2VP30-5FFG896I
Manufacturer
AMD Xilinx
Introduction
High-performance FPGA (Field Programmable Gate Array) chip for embedded systems
Product Features and Performance
30,816 logic elements/cells
2,506,752 total RAM bits
3,424 logic array blocks (LABs)/configurable logic blocks (CLBs)
556 I/O pins
Operating temperature range: -40°C to 100°C
Product Advantages
Flexible and reconfigurable architecture
High logic density and performance
Supports various I/O standards
Suitable for a wide range of embedded applications
Key Technical Parameters
Package: 896-FCBGA (31x31)
Supply voltage: 1.425V to 1.575V
Moisture Sensitivity Level (MSL): 4 (72 hours)
Quality and Safety Features
Lead-free and RoHS compliant
Compatibility
Compatible with Virtex-II Pro FPGA series
Application Areas
Embedded systems
Industrial automation
Telecommunications
Military and aerospace applications
Product Lifecycle
Currently in production
Replacement or upgrade options available
Key Reasons to Choose This Product
High logic capacity and performance
Flexible and reconfigurable architecture
Wide operating temperature range
Lead-free and RoHS compliant
Compatibility with Virtex-II Pro series
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