Manufacturer Part Number
XC2V250-4FGG456C
Manufacturer
Xilinx
Introduction
The XC2V250-4FGG456C is part of the Virtex®-II series, belonging to Xilinx's family of Embedded FPGAs (Field Programmable Gate Arrays). Notably designed for diverse and complex digital circuit configurations, it offers high performance and flexibility for custom hardware logic designs.
Product Features and Performance
250,000 logic gates for versatile configuration
384 Logic Array Blocks/Configurable Logic Blocks for customizable logic
442,368 total RAM bits for ample data storage
200 I/O pins for extensive external connections
Surface Mount Technology for a secure and reduced footprint
Operating temperature range: 0°C ~ 85°C, accommodating various environments
Supply Voltage Range: 1.425V ~ 1.575V, ensuring low power operation
Integrated in a 456-ball Fine-Pitch Ball Grid Array package for compact integration
Product Advantages
High-density gate count enables complex logic implementation
Flexible RAM allocation supports a range of data storage needs
Adequate I/O count facilitates versatile peripheral and external device interfacing
Supports a wide range of operating temperatures for reliability in diverse conditions
Low voltage operation helps in reducing overall power consumption
Key Technical Parameters
Number of LABs/CLBs: 384
Total RAM Bits: 442,368
Number of I/O: 200
Number of Gates: 250,000
Voltage Supply: 1.425V ~ 1.575V
Operating Temperature: 0°C ~ 85°C
Quality and Safety Features
Compliance with industry-standard packaging and safety norms
Extensive quality and reliability testing to ensure high performance in diverse applications
Compatibility
Compatible with various design and development software provided by Xilinx, enabling streamlined design processes
Support for multiple I/O standards for easy integration with other components and systems
Application Areas
Telecommunications
Data Processing
Industrial Control Systems
Consumer Electronics
Automotive Electronics
Product Lifecycle
This product is marked as Obsolete, indicating the end of its manufacturing life. Potential replacements or upgrades may be available, and users are recommended to contact Xilinx for further information.
Several Key Reasons to Choose This Product
High integration capability allows for the development of complex digital systems within a single chip
Flexible design options through configurable logic blocks and adjustable RAM
Low power consumption enhances efficiency and reduces heat output
Wide operating temperature range ensures reliability under various environmental conditions
Support from Xilinx through development tools and software makes design implementation easier
