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HomeProductsIntegrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)XC2S200-6FGG456C
XC2S200-6FGG456C Image
Image may be representation.
See specifications for product details.

XC2S200-6FGG456C - AMD

Manufacturer Part Number
XC2S200-6FGG456C
Manufacturer
AMD Xilinx
Allelco Part Number
32D-XC2S200-6FGG456C
ECAD Model
Parts Description
IC FPGA 284 I/O 456FBGA
Detailed Description
Package
456-BBGA
Data sheet
XC2S200-6FGG456C.pdf
RoHs Status
ROHS3 Compliant
In stock: 244

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Quantity

Specifications

XC2S200-6FGG456C Tech Specifications
AMD - XC2S200-6FGG456C technical specifications, attributes, parameters and parts with similar specifications to AMD - XC2S200-6FGG456C

Product Attribute Attribute Value  
Manufacturer AMD Xilinx  
Voltage - Supply 2.375V ~ 2.625V  
Total RAM Bits 57344  
Supplier Device Package 456-FBGA (23x23)  
Series Spartan®-II  
Package / Case 456-BBGA  
Package Tray  
Product Attribute Attribute Value  
Operating Temperature 0°C ~ 85°C (TJ)  
Number of Logic Elements/Cells 5292  
Number of LABs/CLBs 1176  
Number of I/O 284  
Number of Gates 200000  
Mounting Type Surface Mount  
Base Product Number XC2S200  

Parts Introduction

Manufacturer Part Number

XC2S200-6FGG456C

Manufacturer

Xilinx

Introduction

The XC2S200-6FGG456C is a high-performance Field Programmable Gate Array from Xilinx's Spartan®-II series, designed for embedded applications requiring flexible, on-the-go programmability.

Product Features and Performance

Embedded FPGA featuring 5292 logic elements/cells and 1176 LABs/CLBs

Total RAM bits of 57344 for extensive data handling

200,000 logic gates that enhance computing capabilities

Functionality across a supply voltage of 2.375V to 2.625V

Operates effectively within a temperature range of 0°C to 85°C

Product Advantages

High density and functionality with a substantial number of logic elements and gates

Wide range of input/output options with 284 available I/Os

Stable operation in varying thermal and power conditions

Key Technical Parameters

Number of LABs/CLBs: 1176

Number of Logic Elements/Cells: 5292

Total RAM Bits: 57344

Number of I/O: 284

Number of Gates: 200000

Voltage Supply: 2.375V ~ 2.625V

Operating Temperature: 0°C ~ 85°C

Quality and Safety Features

Built for reliable surface mount technology with a robust 456-BGA package

Compatibility

Compatible with multiple programming technologies and frameworks due to its flexible design and numerous I/O ports

Application Areas

Ideally suited for telecommunications, automotive, consumer electronics, and industrial automation

Product Lifecycle

Status: Last Time Buy, indicating the closing phase of availability with focus on securing replacements or upgrades

Several Key Reasons to Choose This Product

Efficient for complex, high-speed digital signal processing

Scalable logic blocks enable diverse and broad applications

Ensured quality and resilience with an industrial standard packaging

Offers extensive design flexibility due to large amounts of programmable logic cells and gates

Supported by Xilinx programming tools and software for easy integration

Parts with Similar Specifications

The three parts on the right have similar specifications to AMD XC2S200-6FGG456C

Product Attribute XC2S200-6FGG456C XC2S200-5FGG456I XC2S200E-6FG456C XC2S200-6PQ208C
Part Number XC2S200-6FGG456C XC2S200-5FGG456I XC2S200E-6FG456C XC2S200-6PQ208C
Manufacturer AMD AMD AMD AMD
Series Spartan®-II Spartan®-II Spartan®-IIE Spartan®-II
Number of LABs/CLBs 1176 1176 1176 1176
Voltage - Supply 2.375V ~ 2.625V 2.375V ~ 2.625V 1.71V ~ 1.89V 2.375V ~ 2.625V
Package / Case 456-BBGA 456-BBGA 456-BBGA 208-BFQFP
Number of Logic Elements/Cells 5292 5292 5292 5292
Base Product Number XC2S200 XC2S200 XC2S200E XC2S200
Number of I/O 284 284 289 140
Total RAM Bits 57344 57344 57344 57344
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Supplier Device Package 456-FBGA (23x23) 456-FBGA (23x23) 456-FBGA (23x23) 208-PQFP (28x28)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Number of Gates 200000 200000 200000 200000
Package Tray Tray Tray Tray

XC2S200-6FGG456C Datasheet PDF

Download XC2S200-6FGG456C pdf datasheets and AMD documentation for XC2S200-6FGG456C - AMD.

Environmental Information
Xilinx REACH211 Cert.pdf

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Your Faithful Supply Chain Partner -

Contact us if you have any questions.

  1. Phone
    +00852 9146 4856

Certifications & Memberships

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XC2S200-6FGG456C

AMD
32D-XC2S200-6FGG456C

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