Manufacturer Part Number
XC17S30XLPDG8C
Manufacturer
Xilinx
Introduction
Memory configuration PROM designed for programming Xilinx FPGAs
Product Features and Performance
300kb memory size
One-Time Programmable (OTP) technology
Supply voltage between 3V and 3.6V
Operates at temperatures ranging from 0°C to 70°C
Through-hole mounting type
8-DIP package design for easy integration
Product Advantages
Optimized for and compatible with xilinx FPGA devices
Simplifies the FPGA configuration process
Non-volatile memory retains configuration data
Key Technical Parameters
Memory Size: 300kb
Voltage - Supply: 3V to 3.6V
Operating Temperature: 0°C to 70°C
Mounting Type: Through Hole
Package / Case: 8-DIP
Quality and Safety Features
Industry standard for quality and reliability
Ensures FPGA configuration integrity
Compatibility
Designed for use with Xilinx FPGA series
Application Areas
FPGA configuration across various industries including telecommunications, consumer electronics, and automotive
Product Lifecycle
Obsolete product status
End-of-life with limited to no available stock
Recommendation to seek alternatives or contact manufacturer for potential last-time buy options
Several Key Reasons to Choose This Product
Designed specifically for compatible Xilinx FPGAs
Ensures a reliable configuration memory solution
Easy to integrate into PCBs with DIP package
Supports a standard voltage range for power supply compatibility