XC17S200APDG8C - AMD

Manufacturer Part Number

XC17S200APDG8C

Manufacturer

Xilinx

Introduction

PROM for FPGA configuration storage

Product Features and Performance

One-Time Programmable PROM

2MB memory size

3V to 3.6V supply voltage range

0°C to 70°C operating temperature

Through Hole mounting

8-DIP package

Product Advantages

Direct in-system programmability

Simple interface to FPGAs

Key Technical Parameters

Memory Type: OTP

Memory Size: 2MB

Voltage - Supply: 3V ~ 3.6V

Operating Temperature: 0°C ~ 70°C

Mounting Type: Through Hole

Package / Case: 8-DIP

Quality and Safety Features

High reliability

Industry-standard quality assurance

Compatibility

Designed for configuration of Xilinx FPGAs

Application Areas

FPGA-based systems

Embedded Systems

Telecommunications

Industrial

Product Lifecycle

Obsolete

Potential for replacements or upgrades should be considered

Several Key Reasons to Choose This Product

Reliable storage solution for FPGA configurations

Industry-standard programmability and support

Designed specifically for Xilinx FPGA devices

Provides long-term design stability for embedded solutions