LTC4359HMS8#PBF - Analog Devices Inc.

Manufacturer Part Number

LTC4359HMS8#PBF

Manufacturer

Analog Devices

Introduction

High-voltage capable ORing controller chip designed to enhance system power redundancy

Product Features and Performance

N+1 ORing Controller for power redundancy

Supports N-Channel MOSFETs

Fast turn-on delay time of 200 µs and turn-off delay time of 300 ns

Maximum output current of 220µA

Low supply current requirement of 150 µA

Wide voltage supply range from 4V to 80V

Operational temperature range from -40°C to 125°C

Product Advantages

Ensures uninterrupted power supply for critical systems

Ideal for high availability systems requiring redundancy

Automotive-grade quality for robust applications

Surface mount technology for compact and efficient PCB design

Key Technical Parameters

Type: N+1 ORing Controller

FET Type: N-Channel

Delay Time - ON: 200 µs

Delay Time - OFF: 300 ns

Current - Output (Max): 220µA

Current - Supply: 150 µA

Voltage - Supply: 4V ~ 80V

Operating Temperature: -40°C ~ 125°C

Quality and Safety Features

Automotive-grade reliability

Specifically designed for use in harsh environments

Quality assured through stringent testing by Analog Devices

Compatibility

Compatible with various N-Channel MOSFETs

Mountable on standard 8-TSSOP and 8-MSOP packages

Application Areas

Redundant Power Supplies

Telecom Infrastructure

Industrial Systems

Automotive Power Systems

Product Lifecycle

Status: Active

Not currently nearing discontinuation

Replacement and upgrade options may be available within the Analog Devices portfolio

Several Key Reasons to Choose This Product

High-voltage range compatibility up to 80V suitable for various power systems

Low quiescent current maximizing system efficiency

Rapid response times to power changes, ensuring reliable system performance

Adherence to automotive-grade standards, applicable for use in rigorous environments

Provision for redundant configuration, significantly reducing the risk of system downtime

Ease of integration due to surface-mount package design.