ADP3624ARDZ-RL - Analog Devices Inc.

Manufacturer Part Number

ADP3624ARDZ-RL

Manufacturer

Analog Devices

Introduction

High-speed dual-channel low-side gate driver for N-Channel MOSFET power management

Product Features and Performance

Low-side gate driver configuration

Independent channel operation

Drive capability for two N-Channel MOSFETs

Peak output current of 4A for both source and sink

Fast rise and fall times of 10ns typical

Wide supply voltage range from 4.5V to 18V

Compatible logic voltage levels with VIH of 2V and VIL of 0.8V

High operating temperature range from -40°C to 150°C

Product Advantages

High-speed performance enhances efficiency

Dual independent channels allow for flexibility in design

High peak current capability improves power handling

Wide voltage range accommodates various application needs

Robust thermal performance with exposed pad SOIC package

Key Technical Parameters

Number of Drivers: 2

Gate Type: N-Channel MOSFET

Voltage Supply: 4.5V to 18V

Logic Voltage VIL, VIH: 0.8V, 2V

Current Peak Output: 4A (source), 4A (sink)

Rise / Fall Time: 10ns typical

Operating Temperature Range: -40°C to 150°C

Quality and Safety Features

Built to withstand high temperatures for reliability

Conformant to industry safety and quality norms

Compatibility

Compatible with a wide range of N-channel MOSFETs

Suitable for logic interfacing with standard CMOS and TTL levels

Application Areas

DC/DC converters

Motor drivers

Power supply controllers

Electronic switches

High-speed power switching circuits

Product Lifecycle

Product Status: Active

Not reported to be near discontinuation

Future replacements or upgrades are typically provided by the manufacturer

Several Key Reasons to Choose This Product

Manufactured by Analog Devices, a leader in power management solutions

Ultra-fast response times suitable for high-speed applications

Dual-channel design offers design versatility

High temperature operating range ensures robust performance in challenging conditions

Surface mount package with an exposed pad for improved heat dissipation