Manufacturer Part Number
ADG1334BRSZ-REEL
Manufacturer
Analog Devices
Introduction
High-performance analog switch from Analog Devices delivering reliability and versatility for multiple applications.
Product Features and Performance
4 independent SPST - NO/NC switches
Operating Voltage of Single V+: 12V, Dual V±: ±15V
On-State Resistance Max of 200Ohm
Channel-to-Channel Matching ΔRon of 5Ohm
Switch Time Max of 130ns for Ton, 85ns for Toff
-3db Bandwidth of 700MHz
Charge Injection of 2pC
Channel Capacitance CS(off), CD(off) of 5pF
Current Leakage IS(off) Max of 10nA
Crosstalk of -85dB @ 1MHz
Temperature tolerance between -40°C ~ 105°C
Product Advantages
Low on-state resistance enhances signal integrity
Minimal charge injection for more precise signal processing
Rapid switching speed ideal for high-frequency applications
Low crosstalk maintains signal separation
High bandwidth suitable for video and audio signals
Extended temperature range for use in industrial environments
Key Technical Parameters
SPST - NO/NC configuration
1:1 Multiplexer/Demultiplexer Circuit
4 independent circuits
Voltage - Supply, Single/Dual: 12V / ±15V
Temperature Range: -40°C ~ 105°C
SSOP Package ensuring compact design and surface mount compatibility
Quality and Safety Features
Robust design with high-quality materials for extended lifespan
Compliant with industry safety standards
Compatibility
Surface Mount mounting type
20-SSOP package compatible with standard PCB layouts
Application Areas
Communication systems
Data acquisition
Test equipment
Audio and video switching
Product Lifecycle
Active product status with ongoing manufacturer support
Not reported as nearing discontinuation
Potential for future replacements or upgrades
Several Key Reasons to Choose This Product
Ultra-low on-state resistance for high signal fidelity
Broadband width supporting high-speed data applications
Low charge injection for accurate analog-signal processing
Integrated crosstalk minimizes interference between signals
Substantial temperature range for diverse environmental conditions
Compact packaging suitable for space-constrained applications