ADF7023BCPZ-RL - Analog Devices Inc.

Manufacturer Part Number

ADF7023BCPZ-RL

Manufacturer

Analog Devices, Inc.

Introduction

Highly integrated, low-power RF transceiver IC for wireless connectivity applications in the sub-1GHz ISM bands

Product Features and Performance

Operates in the 431MHz ~ 464MHz and 862MHz ~ 928MHz frequency bands

Supports various modulation schemes including 2FSK, GFSK, GMSK, MSK, and OOK

Provides up to 300kbps data rate

Achieves high sensitivity of -116dBm

Delivers up to 13.5dBm output power

Integrated 4kB ROM and 2.5kB RAM

Includes 6 GPIOs for flexible system integration

Product Advantages

Highly integrated design reduces system complexity and BOM cost

Low power consumption, suitable for battery-powered applications

Flexible frequency and modulation options enable support for various wireless protocols

High performance RF transceiver with advanced features

Key Technical Parameters

Operating Frequency: 431MHz ~ 464MHz, 862MHz ~ 928MHz

Operating Temperature: -40°C ~ 85°C

Supply Voltage: 2.2V ~ 3.6V

Transmit Current: 8.7mA ~ 32.1mA

Receive Current: 12.8mA

Output Power: 13.5dBm

Sensitivity: -116dBm

Data Rate: Up to 300kbps

Memory: 4kB ROM, 2.5kB RAM

Interfaces: SPI

Quality and Safety Features

Compliant with RoHS3 directive

Exposed pad package (32-WFQFN) for improved thermal performance and reliability

Compatibility

Suitable for a wide range of wireless connectivity applications in the sub-1GHz ISM bands

Application Areas

IoT devices

Industrial automation

Smart home and building automation

Wireless sensors and control systems

Metering and monitoring applications

Product Lifecycle

The ADF7023BCPZ-RL is an actively supported product, with no indication of discontinuation or end-of-life.

Replacement and upgrade options may be available from Analog Devices, depending on evolving application requirements.

Key Reasons to Choose This Product

Highly integrated, low-power RF transceiver with advanced features

Supports multiple frequency bands and modulation schemes, enabling flexibility in wireless protocol implementation

Excellent RF performance with high sensitivity and output power

Integrated microcontroller and on-chip memory for autonomous operation

Small footprint and exposed pad package for improved thermal management and reliability

Wide operating temperature range and RoHS3 compliance for robust, reliable operation in diverse environments

Suitable for a wide range of wireless connectivity applications in the sub-1GHz ISM bands