ADCLK950BCPZ - Analog Devices Inc.

Manufacturer Part Number

ADCLK950BCPZ

Manufacturer

Analog Devices

Introduction

The ADCLK950BCPZ is a high-performance clock fanout buffer and multiplexer that operates up to 4.8 GHz, catering to demanding timing solutions.

Product Features and Performance

Capable of handling frequencies up to 4.8 GHz

Supports multiple input types: CML, CMOS, LVDS, LVPECL

Provides LVPECL type output

Integrates Fanout Buffer and Multiplexer functionality

Features a high fanout ratio from 2 inputs to 10 outputs

Designed using Silicon-Germanium (SiGe) technology for high-speed operation

Product Advantages

High frequency and multiple input/output support offer flexibility in application

Advanced SiGe technology enhances speed and performance

Compact 40-VFQFN exposed pad, CSP reduces space requirements on PCBs

Key Technical Parameters

Frequency Max: 4.8 GHz

Voltage Supply: 2.97V ~ 3.63V

Operating Temperature: -40°C ~ 85°C

Differential Input/Output: Yes

Number of Circuits: 1

Ratio Input:Output: 2:10

Quality and Safety Features

Operates reliably across a wide temperature range -40°C to 85°C

Robust voltage supply tolerance from 2.97V to 3.63V

Compatibility

Multiple input types compatibility: CML, CMOS, LVDS, LVPECL

LVPECL output compatible with high-speed digital systems

Application Areas

Telecommunication infrastructure

Data centers

High-speed servers and computing applications

Test and measurement equipment

Product Lifecycle

Currently active status; not nearing discontinuation

Integrates features ensuring longevity and suitability for long-term deployments

Several Key Reasons to Choose This Product

Exceptional frequency support up to 4.8 GHz for high-speed applications

Adaptability with multiple input and output types offers versatile use in various systems

Implementation of SiGe technology provides enhanced speed, efficiency and performance

Reliable operation in extreme temperatures and varying voltage conditions

Compact package suitable for space-sensitive applications and advancements in dense electronic assemblies