Manufacturer Part Number
ADCLK905BCPZ-R7
Manufacturer
Analog Devices
Introduction
The ADCLK905BCPZ-R7 from Analog Devices is a high-speed buffer/driver designed for clock and data signal conditioning in demanding applications.
Product Features and Performance
Supports 1:1 Ratio Input:Output
Offers differential Input and Output (Yes/Yes)
Capable of handling Clock input
Enables output in ECL, NECL, PECL formats
Achieves a maximum frequency of 7.5 GHz
Operates with a supply voltage range of 2.375V to 3.63V
Operational temperature range from -40°C to 125°C
SiGe technology for enhanced performance
Surface Mount Technology with 16-VFQFN Exposed Pad, CSP packaging
Product Advantages
High-speed performance up to 7.5 GHz ensures suitability for fast applications
Wide voltage supply range offers flexibility in diverse operating conditions
Extended temperature range supports use in harsh environments
Differential signaling support reduces signal interference and improves data integrity
Key Technical Parameters
Maximum Frequency: 7.5 GHz
Voltage Supply: 2.375V ~ 3.63V
Operating Temperature: -40°C ~ 125°C
Package: 16-VFQFN Exposed Pad, CSP
Differential Input:Output: Yes/Yes
Quality and Safety Features
Manufactured by Analog Devices, ensuring high quality and reliability
Designed to meet stringent operational and safety standards
Compatibility
Compatible with various clock signal sources
Suitable for use with ECL, NECL, PECL signal standards
Application Areas
Telecommunications
Data communications
High-speed computing and storage networks
Test and measurement equipment
Military and aerospace electronics
Product Lifecycle
Status: Active
This product is not nearing discontinuation, with continued availability and support from Analog Devices
Several Key Reasons to Choose This Product
Expands applicability due to wide operational temperature and voltage supply range
High-speed capabilities make it suitable for advanced and future-proof applications
Reliability and quality assurance from a reputable manufacturer, Analog Devices
Differential input/output support ensures high signal integrity
Compact and efficient packaging suitable for modern high-density electronic assemblies