AD8155ACPZ - Analog Devices Inc.

Manufacturer Part Number

AD8155ACPZ

Manufacturer

Analog Devices

Introduction

High-speed, 2:1 multiplexer/demultiplexer for digital signal routing.

Product Features and Performance

XStream™ technology for high-speed data processing

Dual 2:1 multiplexer/demultiplexer configuration

Independent circuit design for simplex or duplex operation

Broad voltage supply range (1.6V to 3.6V)

Designed for surface mount technology

Provided in a 64-VFQFN Exposed Pad, CSP package

Suitable for operating in temperatures ranging from -40°C to 85°C

Product Advantages

Flexibility in routing high-speed digital signals

Suitable for various high-speed data applications due to XStream™ technology

Supports single supply operation, streamlining power design

Key Technical Parameters

Circuit: 2 x 2:1

Independent Circuits: 1

Voltage Supply Source: Single Supply

Voltage Supply: 1.6V ~ 3.6V

Current Output High, Low: Not applicable

Operating Temperature: -40°C ~ 85°C

Mounting Type: Surface Mount

Package / Case: 64-VFQFN Exposed Pad, CSP

Supplier Device Package: 64-LFCSP-VQ (9x9)

Base Product Number: AD8155

Quality and Safety Features

Manufactured by Analog Devices, a leader in semiconductor design and manufacturing

Complies with industry standards for quality and safety

Compatibility

Compatible with a variety of digital signal processing applications

Application Areas

Data Communication Equipment

Network Routers and Switches

Signal Distribution Systems

High-speed Data Acquisition Systems

Product Lifecycle

Currently active product

Not indicated as nearing discontinuation

Several Key Reasons to Choose This Product

High-speed signal routing capabilities with XStream™ technology

Flexibility in application due to the dual 2:1 configuration

Wide operating temperature suitable for harsh environments

Manufactured by a reputable and trusted company in the semiconductor industry

Compatible with single supply voltage, facilitating design simplicity

Advanced packaging designed for efficient thermal management and space-saving on PCBs