Manufacturer Part Number
AD5691RACPZ-1RL7
Manufacturer
Analog Devices
Introduction
The AD5691RACPZ-1RL7 from Analog Devices is a high-performance, low-power digital-to-analog converter (DAC) belonging to the nanoDAC+® series. It is encapsulated in an ultra-small, 8-lead LFCSP package, suitable for applications requiring precise data acquisition.
Product Features and Performance
12-bit resolution
Single-channel DAC
Ultra-fast settling time of 7µs
Buffered voltage output
Supports both I2C data interfaces
Can utilize external or internal references
Suitable voltage supply range from 2.7V to 5.5V (Analog) and 1.8V to 5.5V (Digital)
Operating temperature range from -40°C to 105°C
Noise-immune design due to String DAC architecture
Product Advantages
High resolution and accuracy with INL/DNL of ±2 LSB and ±1 LSB Max
Flexibility in reference selection improves adaptability in complex systems
Advanced thermal management suitable for high-temperature operations
Key Technical Parameters
Number of Bits: 12
Settling Time: 7µs
Voltage Supply, Analog: 2.7V ~ 5.5V
Voltage Supply, Digital: 1.8V ~ 5.5V
Maximum INL/DNL: ±2 LSB, ±1 LSB
Operating Temperature: -40°C ~ 105°C
Quality and Safety Features
Robust design, capable of operating in harsh environments
Certified for industrial performance and safety standards
Compatibility
Compatible with I2C interface standards
Applicable for various analog and digital voltage supplies
Application Areas
Industrial automation
Data acquisition systems
Digital signal processing
Portable devices
Precision instrumentation
Product Lifecycle
Currently active and in production
No reported discontinuations, with ongoing support and probable future upgrades
Several Key Reasons to Choose This Product
Remarkably fast settling time making it suitable for high-speed applications
Broad operating temperature range ensures reliability in extreme conditions
High resolution and accuracy benefiting precision applications
Dual supply voltage and reference voltage options offer design versatility
Compact and robust packaging suitable for space-constrained applications