UMC and Intel announce cooperation in the 12nm process technology
UMC and Intel announced today (25th) that they will collaborate to develop a 12nm process platform to cope with the rapid growth of mobile, communication infrastructure, and network markets. This long-term partnership combines Intel's large-scale manufacturing capacity in the United States with UMC's extensive wafer foundry experience in mature processes to expand the process portfolio and provide a better regional diversified and resilient supply chain to assist global customers in making better procurement decisions.
Stuart Pann, Intel's senior vice president and general manager of foundry services (IFS), said that for decades, Taiwan, China has been an important member of Asian and global semiconductors and a wide range of technology ecosystems. Intel is committed to cooperating with Taiwanese innovative enterprises such as UMC to provide better services for global customers. The strategic cooperation between Intel and UMC further demonstrates its commitment to providing technology and manufacturing innovation for the global semiconductor supply chain, and is also an important step towards achieving Intel's goal of becoming the world's second largest wafer foundry by 2030.
UMC Co General Manager Wang Shi stated that UMC's collaboration with Intel on the 12nm FinFET process manufactured in the United States is an important part of our company's pursuit of cost-effective capacity expansion and technology node upgrade strategies. This move continues our consistent commitment to our customers. This collaboration will assist customers in smoothly upgrading to this critical technology node, while benefiting from the supply chain resilience brought by expanding production capacity in the North American market. UMC looks forward to strategic cooperation with Intel, leveraging their complementary advantages to expand potential markets and significantly accelerate the timeline of technological development.
This 12nm process will leverage Intel's large-scale manufacturing capabilities and FinFET transistor design experience in the United States, providing a powerful combination of maturity, performance, and energy efficiency. Thanks to UMC's leading position in the manufacturing process and decades of experience in providing PDK and design support to customers, we are able to provide wafer foundry services more effectively. The new process will be developed and manufactured at Intel's 12, 22, and 32 plants located in Ocotillo Technology Fabric, Arizona, USA. By utilizing existing wafer fab equipment, it will significantly reduce upfront investment and optimize utilization.
Both parties will strive to meet customer needs and collaborate to support the design enablement of the 12nm process through electronic design automation (EDA) and IP solutions provided by ecosystem partners. This 12nm process is expected to be put into production in 2027.
Intel has invested and innovated in the United States and globally for over 55 years. In addition to Ireland, Germany, Poland, Israel, and Malaysia, it has also established or planned manufacturing bases and invested in Oregon, Arizona, New Mexico, and Ohio in the United States. Intel wafer foundry services (IFS) have made significant progress in 2023 by establishing good interactions with customers, including new customers using Intel 16, Intel 3, and Intel 18A process technologies, and expanding their continuously growing wafer foundry ecosystem. IFS expects to continue making progress in 2024.
For over forty years, UMC has been the preferred wafer foundry for key application chips in the global automotive, industrial, display, and communication industries. UMC continues to lead innovation in mature and specialized process technologies, and in the past two decades, has successfully expanded its manufacturing base to various countries in Asia. UMC is an important wafer manufacturing partner for over 400 semiconductor customers, focusing on helping customers achieve high product yield and maintaining industry-leading capacity utilization.
UMC Co General Manager Wang Shi stated that UMC's collaboration with Intel on the 12nm FinFET process manufactured in the United States is an important part of our company's pursuit of cost-effective capacity expansion and technology node upgrade strategies. This move continues our consistent commitment to our customers. This collaboration will assist customers in smoothly upgrading to this critical technology node, while benefiting from the supply chain resilience brought by expanding production capacity in the North American market. UMC looks forward to strategic cooperation with Intel, leveraging their complementary advantages to expand potential markets and significantly accelerate the timeline of technological development.
This 12nm process will leverage Intel's large-scale manufacturing capabilities and FinFET transistor design experience in the United States, providing a powerful combination of maturity, performance, and energy efficiency. Thanks to UMC's leading position in the manufacturing process and decades of experience in providing PDK and design support to customers, we are able to provide wafer foundry services more effectively. The new process will be developed and manufactured at Intel's 12, 22, and 32 plants located in Ocotillo Technology Fabric, Arizona, USA. By utilizing existing wafer fab equipment, it will significantly reduce upfront investment and optimize utilization.
Both parties will strive to meet customer needs and collaborate to support the design enablement of the 12nm process through electronic design automation (EDA) and IP solutions provided by ecosystem partners. This 12nm process is expected to be put into production in 2027.
Intel has invested and innovated in the United States and globally for over 55 years. In addition to Ireland, Germany, Poland, Israel, and Malaysia, it has also established or planned manufacturing bases and invested in Oregon, Arizona, New Mexico, and Ohio in the United States. Intel wafer foundry services (IFS) have made significant progress in 2023 by establishing good interactions with customers, including new customers using Intel 16, Intel 3, and Intel 18A process technologies, and expanding their continuously growing wafer foundry ecosystem. IFS expects to continue making progress in 2024.
For over forty years, UMC has been the preferred wafer foundry for key application chips in the global automotive, industrial, display, and communication industries. UMC continues to lead innovation in mature and specialized process technologies, and in the past two decades, has successfully expanded its manufacturing base to various countries in Asia. UMC is an important wafer manufacturing partner for over 400 semiconductor customers, focusing on helping customers achieve high product yield and maintaining industry-leading capacity utilization.