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on August 31th

TSMC's advanced process advantages are hard to shake

TSMC (2330) is a global leader in wafer foundry, especially in the field of advanced processes. Intel expands wafer foundry, Samsung strengthens advanced processes, and both industry giants want to seize the relevant wafer foundry market share, but so far the results have been limited. Research institutions expect TSMC to continue to increase its quotation with advanced process capabilities by 2025, and its performance will continue to grow without any worries.


TSMC President Wei Zhejia previously mentioned that he has expressed to competitors that "customer trust" is very important, and that technology and manufacturing may one day catch up with TSMC or be equally good. Although he thinks it is unlikely, in terms of customer trust, competitors will never catch up with TSMC. The first step in gaining customer trust is not to compete with them. He said that two formidable competitors, one in California and the other in South Korea, both have their own products and want to compete with TSMC, but in simple terms, they have "no way". The outside world believes that Wei Zhejia's implied opponents are Samsung and Intel.

In addition to competing with customers, TSMC continues to lead in advanced process technology and is developing a 2-nanometer process. It is expected that N2 process technology can provide performance and power advantages for the entire generation.
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