TSMC President Wei Zhe's visit to ASML has sparked speculation among the public that Lenovo may change its mindset
TSMC has repeatedly stated that ASML's High Numerical Aperture Extreme Ultraviolet (HI-NA EUV) machine is too expensive and will not have significant economic benefits before 2026. However, recently, TSMC President Wei Zhejia visited ASML headquarters in secret, causing speculation from the outside world whether TSMC has changed its mind.
Financial analyst Dan Nystedt wrote on the X platform on the 28th that TSMC seems to have joined the battle to pursue the next generation of EUV devices, namely the High-NA EUV machines, citing Wei Zhe's visit to ASML and laser supplier Chuangpu, rather than participating in a technology forum held in Taiwan. Industry speculation suggests that the visit of Wei Zhe's family indicates that TSMC wants to buy the High-NA EUV, which is crucial for processes below 2 nanometers. ASML shipped the first High-NA EUV to Intel at the end of last year.
Analysis indicates that TSMC's management seems to have decided to visit ASML to ensure the global dominance of semiconductors.
TSMC originally planned to introduce High-NA EUV after mass production of 1.6 nanometers in the second half of 2026. The price of High-NA EUV equipment is as high as 380 million US dollars, about 12.3 billion New Taiwan dollars, more than twice that of EUV.
TSMC's competitors Intel and Samsung Electronics have both taken action. Intel wants to leverage High-NA EUV to achieve an unbeatable leading advantage. The first few High-NA EUVs to be shipped were all sent to Intel's wafer foundry department. Intel wants to first try out this device at 1.8 nanometers and then officially import it into the 1.4 nanometers process.
Samsung Group President Lee Jae yong visited the German headquarters of ASML's key partner, Zeiss, in April to meet with ASML CEO Fu Kai and Zeiss CEO Lamprecht to strengthen the semiconductor alliance among the three parties.
Analysis indicates that TSMC's management seems to have decided to visit ASML to ensure the global dominance of semiconductors.
TSMC originally planned to introduce High-NA EUV after mass production of 1.6 nanometers in the second half of 2026. The price of High-NA EUV equipment is as high as 380 million US dollars, about 12.3 billion New Taiwan dollars, more than twice that of EUV.
TSMC's competitors Intel and Samsung Electronics have both taken action. Intel wants to leverage High-NA EUV to achieve an unbeatable leading advantage. The first few High-NA EUVs to be shipped were all sent to Intel's wafer foundry department. Intel wants to first try out this device at 1.8 nanometers and then officially import it into the 1.4 nanometers process.
Samsung Group President Lee Jae yong visited the German headquarters of ASML's key partner, Zeiss, in April to meet with ASML CEO Fu Kai and Zeiss CEO Lamprecht to strengthen the semiconductor alliance among the three parties.