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on December 29th

Three global semiconductor giants, driving more than NT $400 billion to invest in Taiwan, China

Semiconductor cluster effect fermentation, international manufacturers have settled in Taiwan, China, China. The local economic department said on December 28 that the leading foreign enterprises Lam Research, ASML and Applied Materials all announced the establishment of high-end research and development centers in Taiwan, which is expected to increase the purchase of NT $13.3 billion from Taiwan (the same unit below), driving 433.7 billion of investment in Taiwan.


The economic department said that, as the world's third largest supplier of semiconductor wafer equipment manufacturing and service, Fanlin Group has set up an advanced node and high-end process technology research and development center in Taiwan, China to enhance Taiwan's independent research and development energy in advanced nodes and high-end process technology. If ASML and application materials are added, all the top three semiconductor equipment manufacturers in the world are in place.

After the three giants set up high-end R&D centers in Taiwan, China, in addition to promoting procurement and investment in Taiwan, they can also drive 50 local manufacturers to participate in foreign R&D and enter the international supply chain. Therefore, Taiwan has become the place with the highest density of semiconductor equipment R&D in the world. The local economic department has invested nearly 6.5 billion yuan in the past five years to subsidize local equipment and material industry players in research and development, driving 137 self-developed products into the international semiconductor supply chain.

In addition, subsidies will be provided to local semiconductor equipment and material manufacturers for independent technology research and development, assisting in the quality and reliability verification of self-produced equipment and materials by semiconductor international giants such as TSMC, Sunrise, and Liandian, and achieving breakthroughs in semiconductor front-end production equipment, high-end packaging equipment, and key process materials.
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