The United States will provide Absolics with $75 million in advanced chip packaging subsidies
The US Department of Commerce has announced plans to allocate $75 million to Absolics to build a 120000 square foot factory in Georgia to supply advanced materials to the country's semiconductor industry.
The subsidy planned to be granted to this semiconductor packaging supplier will come from the US government's $52.7 billion chip manufacturing and subsidy fund, Absolics is a subsidiary of SKC, which is also a part of SK Group in South Korea.
This funding will be used to develop advanced packaging technology, marking the first commercial facility to use new advanced materials to support the semiconductor supply chain.
The US Department of Commerce stated that the award will also support 1000 construction jobs and 200 manufacturing and research and development jobs in Cavanton, Georgia.
Absolics' glass substrates allow processing and storage chips to be packaged into a single device, enabling faster and more efficient computing.
Absolics was established in 2021, and the Georgia factory broke ground in November 2022. Applied materials companies are investors.
Absolute CEO Jun Rok Oh stated in a statement that the proposed funding will enable the company "to fully commercialize the groundbreaking glass substrate technology we use in high-performance computing and cutting-edge defense applications."
The US Department of Commerce stated that, Absolute's glass substrate will be used to improve the performance of cutting-edge chips in artificial intelligence (AI) and data centers.
In April this year, SK Hynix announced that it will invest $3.87 billion to build an advanced AI product packaging factory and research and development facility in Indiana.
US Secretary of Commerce Gina Raymond previously pointed out that the advanced packaging substrate market is currently concentrated in Asia, and she has made advanced packaging a priority. Last year, she stated that "the United States will build multiple large-scale advanced packaging facilities.".
Last November, the US Department of Commerce announced plans to spend $3 billion to support advanced packaging.
In the same month, Amkor announced that it will spend $2 billion to build a new advanced packaging and testing facility in Arizona, which will package and test Apple chips produced by nearby TSMC.
The US Department of Commerce recently announced several major proposed appropriations for the Chip Act, including $8.5 billion for Intel, $6.6 billion for TSMC, $6.4 billion for Samsung, and $6.1 billion for Micron Technology.
This funding will be used to develop advanced packaging technology, marking the first commercial facility to use new advanced materials to support the semiconductor supply chain.
The US Department of Commerce stated that the award will also support 1000 construction jobs and 200 manufacturing and research and development jobs in Cavanton, Georgia.
Absolics' glass substrates allow processing and storage chips to be packaged into a single device, enabling faster and more efficient computing.
Absolics was established in 2021, and the Georgia factory broke ground in November 2022. Applied materials companies are investors.
Absolute CEO Jun Rok Oh stated in a statement that the proposed funding will enable the company "to fully commercialize the groundbreaking glass substrate technology we use in high-performance computing and cutting-edge defense applications."
The US Department of Commerce stated that, Absolute's glass substrate will be used to improve the performance of cutting-edge chips in artificial intelligence (AI) and data centers.
In April this year, SK Hynix announced that it will invest $3.87 billion to build an advanced AI product packaging factory and research and development facility in Indiana.
US Secretary of Commerce Gina Raymond previously pointed out that the advanced packaging substrate market is currently concentrated in Asia, and she has made advanced packaging a priority. Last year, she stated that "the United States will build multiple large-scale advanced packaging facilities.".
Last November, the US Department of Commerce announced plans to spend $3 billion to support advanced packaging.
In the same month, Amkor announced that it will spend $2 billion to build a new advanced packaging and testing facility in Arizona, which will package and test Apple chips produced by nearby TSMC.
The US Department of Commerce recently announced several major proposed appropriations for the Chip Act, including $8.5 billion for Intel, $6.6 billion for TSMC, $6.4 billion for Samsung, and $6.1 billion for Micron Technology.