The South Korean government collaborates with Samsung Electronics, SK Hynix, and others to develop advanced semiconductor packaging technology
According to BusinessKorea, the South Korean government is in agreement with major semiconductor giants such as Samsung Electronics and SK Hynix in developing advanced semiconductor packaging technology.
On August 29th, the South Korean Ministry of Industry, Commerce, and Resources (MOTIE) announced the signing of agreements with semiconductor companies and organizations to collaborate on the development of advanced packaging technologies. South Korea leads in the field of storage semiconductor manufacturing, but lags behind the United States and Taiwan, China in the field of system semiconductor.
The report states that in order to develop system semiconductors, it is necessary for South Korea to establish an ecosystem by developing specialized companies in the fields of wafer free factories, packaging, OEM, and outsourced semiconductor assembly and testing (OSAT). Although South Korea has performed well in the field of OEM with its semiconductor manufacturing capabilities, it has performed poorly in other fields. Therefore, the government is strengthening its support for Korean companies in other fields through policies.
Semiconductor packaging is a technology that bundles circuits designed by wafer companies for different applications. With the miniaturization of semiconductor processes reaching the limit of packaging more technologies in the same size and area, the development of low-power, high-performance, multifunctional, and highly integrated semiconductor technologies through advanced packaging is becoming the core competitiveness of system semiconductor manufacturers.
The South Korean Ministry of Industry, Commerce, and Resources (MOTIE), as well as companies and organizations in the field of system semiconductors, participated in the ceremony to develop technology and enhance capabilities in the packaging field. The signatories include MOTIE, Samsung Electronics, SK Hynix, LG Chemical, Hana Micron, Protec, Sapeon, Symtec, Next Generation Intelligent Semiconductor Business Group, Korea Semiconductor Industry Association, and Korea Industrial Technology Evaluation Institute.
According to the agreement, MOTIE plans to promote new research and development projects related to advanced packaging, which will require significant government investment. We will also establish cooperation systems with semiconductor research centers in the United States and the European Union, as well as global OSAT companies.
The report states that in order to develop system semiconductors, it is necessary for South Korea to establish an ecosystem by developing specialized companies in the fields of wafer free factories, packaging, OEM, and outsourced semiconductor assembly and testing (OSAT). Although South Korea has performed well in the field of OEM with its semiconductor manufacturing capabilities, it has performed poorly in other fields. Therefore, the government is strengthening its support for Korean companies in other fields through policies.
Semiconductor packaging is a technology that bundles circuits designed by wafer companies for different applications. With the miniaturization of semiconductor processes reaching the limit of packaging more technologies in the same size and area, the development of low-power, high-performance, multifunctional, and highly integrated semiconductor technologies through advanced packaging is becoming the core competitiveness of system semiconductor manufacturers.
The South Korean Ministry of Industry, Commerce, and Resources (MOTIE), as well as companies and organizations in the field of system semiconductors, participated in the ceremony to develop technology and enhance capabilities in the packaging field. The signatories include MOTIE, Samsung Electronics, SK Hynix, LG Chemical, Hana Micron, Protec, Sapeon, Symtec, Next Generation Intelligent Semiconductor Business Group, Korea Semiconductor Industry Association, and Korea Industrial Technology Evaluation Institute.
According to the agreement, MOTIE plans to promote new research and development projects related to advanced packaging, which will require significant government investment. We will also establish cooperation systems with semiconductor research centers in the United States and the European Union, as well as global OSAT companies.