The battle for advanced packaging is intensifying, and Samsung is restructuring its team to address the challenges
In August, TSMC acquired the INNOLUX Tainan factory as a CoWoS production base, marking an important step in the ongoing competition between TSMC and Samsung Electronics in the semiconductor packaging field. This acquisition is part of TSMC's broader strategy to maintain market dominance, as TSMC currently holds a stable 62% market share with its advanced 2.5D packaging technology CoWoS.According to industry insiders on September 1st, Samsung's Device Solutions (DS) division has recently undergone organizational restructuring and personnel expansion to enhance its packaging competitiveness. This move comes at a time when Samsung is facing increasing challenges in the semiconductor foundry industry, especially in the packaging sector, where TSMC has been strengthening its position for over a decade.
Samsung Electronics has restructured its Advanced Packaging (AVP) business team into a development team and actively recruited experienced simulation, design, and analysis professionals for research and development. An industry insider familiar with Samsung's internal situation commented, "They are mobilizing immediately available solutions to enhance packaging capabilities and expand the organization to maximize synergies
As the implementation of circuits in front-end processes reaches its limits, the demand for advanced packaging in the market has surged. High performance packaging technology is crucial for the AI chips required by major global technology companies such as NVIDIA, AMD, and Apple. TSMC's CoWoS technology maximizes the connectivity between storage and logic semiconductors, giving it a competitive advantage in meeting these demands.
TSMC continues to invest heavily in the packaging field, plans to expand production capacity, and research next-generation technologies such as FO-PLP. Industry predictions suggest that TSMC will build two new factories next year, increasing packaging capacity by up to 70% to 80%.
According to the statistics of TechSearch, a market research company, last year South Korea's share in the global OSAT market was 4.3%, and Taiwan, China, China, ranked first with a share of 46.2%. Samsung Electronics is vigorously promoting turnkey services and FO-PLP technology, but has not yet gained important major customers.
An industry insider pointed out that "packaging is an area where TSMC has been strengthening its competitiveness for more than a decade. It is still increasing its investment in advanced technology, and Samsung Electronics will find it difficult to catch up overnight. In order to ensure its market share in the OEM market, Samsung needs to accelerate and expand its packaging investment scale
As the implementation of circuits in front-end processes reaches its limits, the demand for advanced packaging in the market has surged. High performance packaging technology is crucial for the AI chips required by major global technology companies such as NVIDIA, AMD, and Apple. TSMC's CoWoS technology maximizes the connectivity between storage and logic semiconductors, giving it a competitive advantage in meeting these demands.
TSMC continues to invest heavily in the packaging field, plans to expand production capacity, and research next-generation technologies such as FO-PLP. Industry predictions suggest that TSMC will build two new factories next year, increasing packaging capacity by up to 70% to 80%.
According to the statistics of TechSearch, a market research company, last year South Korea's share in the global OSAT market was 4.3%, and Taiwan, China, China, ranked first with a share of 46.2%. Samsung Electronics is vigorously promoting turnkey services and FO-PLP technology, but has not yet gained important major customers.
An industry insider pointed out that "packaging is an area where TSMC has been strengthening its competitiveness for more than a decade. It is still increasing its investment in advanced technology, and Samsung Electronics will find it difficult to catch up overnight. In order to ensure its market share in the OEM market, Samsung needs to accelerate and expand its packaging investment scale