South Korean JNTC provides new TGV glass substrates to three chip packaging companies
South Korean 3D cover glass manufacturer JNTC recently announced that it has provided samples of a new type of TGV glass substrate with dimensions of 510 × 515mm to three global semiconductor packaging companies.
It is reported that the substrate is much larger than the 100x100mm prototype launched in June.
JNTC stated that compared to the prototype, the new glass substrate adopts more complex through-hole, etching, electroplating, and polishing processes. Compared to its competitors, it has a differentiated advantage in uniformly electroplating the entire substrate.
In addition, JNTC stated that it is in negotiations with three packaging companies regarding specifications and prices.
JNTC plans to begin mass production of this substrate at its Vietnam factory in the second half of 2025.
Previously, JNTC had stated plans to use its technology developed for 3D overlay windows to develop TGV glass substrates.
The company's target market is the glass interlayer market that uses glass instead of silicon.
These intermediate layers can replace the silicon substrate used in chip boards with resin cores. Glass substrates have been used in some high-end medical devices because the chemical properties of glass are superior to silicon.
JNTC stated that compared to the prototype, the new glass substrate adopts more complex through-hole, etching, electroplating, and polishing processes. Compared to its competitors, it has a differentiated advantage in uniformly electroplating the entire substrate.
In addition, JNTC stated that it is in negotiations with three packaging companies regarding specifications and prices.
JNTC plans to begin mass production of this substrate at its Vietnam factory in the second half of 2025.
Previously, JNTC had stated plans to use its technology developed for 3D overlay windows to develop TGV glass substrates.
The company's target market is the glass interlayer market that uses glass instead of silicon.
These intermediate layers can replace the silicon substrate used in chip boards with resin cores. Glass substrates have been used in some high-end medical devices because the chemical properties of glass are superior to silicon.