SK Hynix Vice President: Packaging Technology is the Key to Competing for Semiconductor Dominance
Choi Woo jin, Vice President of Semiconductor Packaging/Testing at SK Hynix, recently stated that in the era of artificial intelligence (AI) with explosive growth in demand for high-performance chips, the company is determined to use cutting-edge packaging technology to contribute to the development of high-performance storage. He believes that packaging technology innovation is becoming the key to competing for the dominant position in semiconductors.
Choi Woo jin is an expert in semiconductor post-processing and has been engaged in the research and development of storage chip packaging for 30 years. He claims that SK Hynix is in line with the era of artificial intelligence, focusing on providing customers with various performance storage chips, including providing various functions, sizes, shapes, and power efficiency.
Choi Woo jin stated, "To achieve this goal, we focus on developing various cutting-edge packaging technologies, such as small chips (Chiplets) and hybrid bonding technology, which will help combine heterogeneous chips such as storage chips and non memory chips. At the same time, SK Hynix will develop silicon via (TSV) technology and MR-MUF technology, which play an important role in manufacturing high bandwidth storage (HBM)."
The executive stated that in response to the surge in DRAM demand caused by the ChatGPT boom in 2023, he quickly led SK Hynix to expand a production line and increase production of DDR5 and server-oriented 3DS memory module products. In addition, he played a key role in the recent plan to build packaging production facilities in Indiana, USA, planning the construction and operation strategy of the factory.
Choi Woo jin stated, "To achieve this goal, we focus on developing various cutting-edge packaging technologies, such as small chips (Chiplets) and hybrid bonding technology, which will help combine heterogeneous chips such as storage chips and non memory chips. At the same time, SK Hynix will develop silicon via (TSV) technology and MR-MUF technology, which play an important role in manufacturing high bandwidth storage (HBM)."
The executive stated that in response to the surge in DRAM demand caused by the ChatGPT boom in 2023, he quickly led SK Hynix to expand a production line and increase production of DDR5 and server-oriented 3DS memory module products. In addition, he played a key role in the recent plan to build packaging production facilities in Indiana, USA, planning the construction and operation strategy of the factory.