SK Hynix HBM3E production time advanced to the end of September
SK Hynix President Kim Joo sun attended "Semicon Taiwan 2024" on September 4th and delivered a keynote speech on "HBM (High Bandwidth Memory) and Advanced Packaging Technology for the AI Era", announcing that SK Hynix will begin mass production of its 12th layer fifth generation high bandwidth memory HBM3E product in September, earlier than the originally planned fourth quarter.
Kim Joo sun stated, "The 8-layer HBM3E product has been available since the beginning of this year and is the industry's first product. The 12 layer product will also begin mass production by the end of this month." This progress is expected to significantly improve data transmission speed and efficiency, which is crucial for HPC (high-performance computing) and artificial intelligence (AI) applications.
Park Moon pil, Vice President of HBM PE (Product Engineering) at SK Hynix, emphasized in an interview the company's advancements in HBM technology. Park Moon pil said, "The HBM PE department has the technical know-how to quickly identify areas for product improvement and ensure mass production capabilities." Park Moon pil added, "After enhancing the integrity of HBM3E through internal verification procedures, we have successfully passed customer testing. We will strengthen our quality verification and customer certification capabilities for next-generation HBM products such as the 12th layer HBM3E and the 6th generation HBM4 to maintain our top competitiveness
In addition, SK Hynix plans to launch a 12 layer HBM4 in the second half of 2025 and a 16 layer HBM4 in 2026. As for the packaging technology of the 16 layer HBM4, the company will decide to use the original MR-MUF or switch to Hybrid Bonding to reduce the thickness.
In addition to the advancements in HBM3E, SK Hynix also plans to launch the industry's highest capacity enterprise solid state drive (eSSD) based on the latest level four unit (QLC) technology. Compared to traditional hard drives (HDDs), this new eSSD will have improved performance in terms of capacity, speed, and capacity. We plan to launch a 120TB model, which will greatly improve energy efficiency and space optimization in the future, "Kim Joo sun revealed
Kim Joo sun stated, "The 8-layer HBM3E product has been available since the beginning of this year and is the industry's first product. The 12 layer product will also begin mass production by the end of this month." This progress is expected to significantly improve data transmission speed and efficiency, which is crucial for HPC (high-performance computing) and artificial intelligence (AI) applications.
Park Moon pil, Vice President of HBM PE (Product Engineering) at SK Hynix, emphasized in an interview the company's advancements in HBM technology. Park Moon pil said, "The HBM PE department has the technical know-how to quickly identify areas for product improvement and ensure mass production capabilities." Park Moon pil added, "After enhancing the integrity of HBM3E through internal verification procedures, we have successfully passed customer testing. We will strengthen our quality verification and customer certification capabilities for next-generation HBM products such as the 12th layer HBM3E and the 6th generation HBM4 to maintain our top competitiveness
In addition, SK Hynix plans to launch a 12 layer HBM4 in the second half of 2025 and a 16 layer HBM4 in 2026. As for the packaging technology of the 16 layer HBM4, the company will decide to use the original MR-MUF or switch to Hybrid Bonding to reduce the thickness.
In addition to the advancements in HBM3E, SK Hynix also plans to launch the industry's highest capacity enterprise solid state drive (eSSD) based on the latest level four unit (QLC) technology. Compared to traditional hard drives (HDDs), this new eSSD will have improved performance in terms of capacity, speed, and capacity. We plan to launch a 120TB model, which will greatly improve energy efficiency and space optimization in the future, "Kim Joo sun revealed