Silicon Motion announces the launch of UFS 4.0 main control chip, manufactured using 6nm EUV
Silicon Motion announced on March 12th the launch of the UFS 4.0 main control chip SM2756, which uses a 6nm process technology and is manufactured using an EUV lithography machine. This product is suitable for mobile devices such as smartphones and can meet the high-speed transmission needs of artificial intelligence (AI).
It is understood that the SM2756 main control chip adopts the MIPI M-PHY low-power architecture, with sequential read performance of up to 4300MB/s and sequential write speed of up to 4000MB/s. It supports 3D TLC and QLC NAND flash memory, and can support up to 2TB capacity.
Silicon Motion has also released a UFS 3.1 main control chip SM2753, which adopts a single channel design and supports 3D TLC and QLC NAND. The sequential read performance is 2150MB/s, and the sequential write performance is 1900MB/s, to meet the needs of smartphone, IoT, and automotive applications.
It is reported that currently, high-end smartphones mostly use UFS 4.0 storage chips, with sequential speeds generally exceeding 3000MB/s and sequential write speeds exceeding 2800MB/s. Compared to UFS 3.1, UFS 4.0 can improve efficiency by 40% and has better data security, with a channel rate of up to 23.2Gbps, which is twice that of the previous generation. The UFS 4.0 chip was first mass-produced in the third quarter of 2022, and the current mainstream product has a maximum capacity of 1TB.