Lam Research exclusively supplies TSV equipment for HBM to original manufacturers such as Samsung
Semiconductor equipment supplier Lam Research is exclusively supplying TSV (Through Silicon Via) etching equipment Synsion and embedding equipment Sabre 3D to Samsung Electronics and SK Hynix, both for HBM production. With the expansion of HBM input/output (I/O), it is expected that the market demand for these two devices will further increase in the future.
According to Lam Research, the company is exclusively supplying TSV etching and inlay equipment to Samsung Electronics and SK Hynix. Both types of devices are used for micro hole copper plating filling of HBM wafers. Simply put, it is the pre wiring work used for HBM signal transmission.
Samsung Electronics and SK Hynix use Synsion as their equipment for TSV etching. Syntheon is a representative deep silicon etching device that can deeply etch into the interior of the wafer to form high aspect ratio features such as TSV and grooves. Lam Research SABRE 3D is used to form TSV wiring, which is a method of creating wiring by filling etched wafer holes with copper. Then, HBM is produced through chemical mechanical polishing (CMP), wafer back grinding, cutting, and chip stacking.
When asked what kind of equipment to provide to the backend process field, a senior official at Lam Research stated that we specialize in supplying Synsion and Sabre 3D equipment (for HBM equipment) to Samsung Electronics and SK Hynix. And it is stated that competitors such as Applied Materials are preparing to enter the market, but so far Lam Research is the only supplier.
According to the HBM roadmap of Samsung Electronics and SK Hynix, the HBM4 planned to be released in 2026 will expand the I/O to 2048. This number is twice the current production of HBM3, so it is expected that the market demand for these two devices will further increase in the future.
Lam Research recently opened an office in Cheonan, South Korea. A senior executive from Lam Research stated that in response to the response of our client company's HBM equipment, we have recently opened an office in Tian'an City. However, the equipment is produced at overseas production bases.
Samsung Electronics and SK Hynix use Synsion as their equipment for TSV etching. Syntheon is a representative deep silicon etching device that can deeply etch into the interior of the wafer to form high aspect ratio features such as TSV and grooves. Lam Research SABRE 3D is used to form TSV wiring, which is a method of creating wiring by filling etched wafer holes with copper. Then, HBM is produced through chemical mechanical polishing (CMP), wafer back grinding, cutting, and chip stacking.
When asked what kind of equipment to provide to the backend process field, a senior official at Lam Research stated that we specialize in supplying Synsion and Sabre 3D equipment (for HBM equipment) to Samsung Electronics and SK Hynix. And it is stated that competitors such as Applied Materials are preparing to enter the market, but so far Lam Research is the only supplier.
According to the HBM roadmap of Samsung Electronics and SK Hynix, the HBM4 planned to be released in 2026 will expand the I/O to 2048. This number is twice the current production of HBM3, so it is expected that the market demand for these two devices will further increase in the future.
Lam Research recently opened an office in Cheonan, South Korea. A senior executive from Lam Research stated that in response to the response of our client company's HBM equipment, we have recently opened an office in Tian'an City. However, the equipment is produced at overseas production bases.