Japanese relief plan to build semiconductor packaging substrate factory in Singapore and start production in 2026
Toppan Holdings announced on March 14th that it plans to build a semiconductor packaging substrate factory in Singapore, with production scheduled for 2026. The company will work with several other Japanese substrate manufacturers to increase capital investment in the context of booming demand for artificial intelligence.
The specific investment amount for building the factory has not been announced by Japan Topside, but it is expected to be around 50 billion yen (approximately 2.43 billion yuan). The factory is expected to create 200 job opportunities, with a total investment of over 100 billion yen in the future as production capacity increases.
It is reported that although Japan Topography will bear the main part of the initial investment, due to its main customer being American semiconductor giant Broadcom, Broadcom may provide financial support for Japan Topography's future capacity expansion in the future.
It is understood that Japanese relief plates currently only produce substrates in the Niigata factory in central Japan, and the planned Singapore factory is closer to the semiconductor rear processing enterprises in Malaysia, Taiwan, China, China, etc. Japan Topside hopes to increase its substrate production capacity to 150% of the 2022 fiscal year by expanding its Niigata factory and constructing a new one.
Packaging substrates are essential materials for semiconductor chips. According to a report from Techno Systems Research, Japanese companies have performed particularly well in the high-performance packaging substrate field of FC-BGA, accounting for 40% of global production capacity.
It is reported that Japanese relief has received support from the Singapore government and Broadcom in terms of factory location and personnel recruitment in Singapore.
It is reported that although Japan Topography will bear the main part of the initial investment, due to its main customer being American semiconductor giant Broadcom, Broadcom may provide financial support for Japan Topography's future capacity expansion in the future.
It is understood that Japanese relief plates currently only produce substrates in the Niigata factory in central Japan, and the planned Singapore factory is closer to the semiconductor rear processing enterprises in Malaysia, Taiwan, China, China, etc. Japan Topside hopes to increase its substrate production capacity to 150% of the 2022 fiscal year by expanding its Niigata factory and constructing a new one.
Packaging substrates are essential materials for semiconductor chips. According to a report from Techno Systems Research, Japanese companies have performed particularly well in the high-performance packaging substrate field of FC-BGA, accounting for 40% of global production capacity.
It is reported that Japanese relief has received support from the Singapore government and Broadcom in terms of factory location and personnel recruitment in Singapore.