It is reported that Samsung has lowered its HBM production capacity target to 170000 units per month
According to reports, industry insiders have revealed that Samsung Electronics has lowered its maximum production capacity (CAPA) target for high bandwidth memory (HBM) by more than 10% by the end of 2025, from 200000 units per month to 170000 units per month. Given the delay in mass production supply to major customers, Samsung seems to have adopted a conservative attitude towards its cutting-edge HBM equipment investment plan.
To enhance semiconductor competitiveness, the company will also directly dispatch R&D personnel to the factory to improve communication and collaboration with frontline production teams.
Until the second quarter of last year, Samsung Electronics planned to increase its HBM production capacity to 140000 to 150000 pieces per month by the end of 2024, and to 200000 pieces per month by the end of 2025. This result reflects the response strategy of its main competitors to increase HBM production, as well as the positive prospect of quality testing being completed for major clients such as Nvidia.
Samsung Electronics announced during its Q2 earnings conference call that "we plan to mass produce and supply HBM3E 8 layers in Q3 and 12 layers in the second half of the year, in line with Samsung Electronics' mass production plan." Samsung expects HBM3E's share of HBM sales to rapidly increase to 10% in Q3 and reach 60% in Q4.
But the situation changed in the second half of this year. Due to the delayed completion of Nvidia's quality testing for the latest generation HBM3E (fifth generation HBM) 8-layer and 12 layer products, Samsung Electronics conservatively adjusted its HBM production plan at the end of this year.
In terms of production capacity, Samsung's HBM production target for 2025 will decrease from 13.5 billion to 14 billion GB to around 12 billion GB.
A source familiar with the matter explained, "As far as I know, due to the sluggish HBM business, Samsung Electronics has decided to slow down its equipment investment pace," and added, "Discussions on additional investment will only begin after mass production and supply to Nvidia
Until the second quarter of last year, Samsung Electronics planned to increase its HBM production capacity to 140000 to 150000 pieces per month by the end of 2024, and to 200000 pieces per month by the end of 2025. This result reflects the response strategy of its main competitors to increase HBM production, as well as the positive prospect of quality testing being completed for major clients such as Nvidia.
Samsung Electronics announced during its Q2 earnings conference call that "we plan to mass produce and supply HBM3E 8 layers in Q3 and 12 layers in the second half of the year, in line with Samsung Electronics' mass production plan." Samsung expects HBM3E's share of HBM sales to rapidly increase to 10% in Q3 and reach 60% in Q4.
But the situation changed in the second half of this year. Due to the delayed completion of Nvidia's quality testing for the latest generation HBM3E (fifth generation HBM) 8-layer and 12 layer products, Samsung Electronics conservatively adjusted its HBM production plan at the end of this year.
In terms of production capacity, Samsung's HBM production target for 2025 will decrease from 13.5 billion to 14 billion GB to around 12 billion GB.
A source familiar with the matter explained, "As far as I know, due to the sluggish HBM business, Samsung Electronics has decided to slow down its equipment investment pace," and added, "Discussions on additional investment will only begin after mass production and supply to Nvidia