Intel is confident in the mass production of Intel 4, with institutions claiming that its performance is 3nm higher than that of TSMC
According to the Telec report, Intel has expressed confidence in mass production of Intel 4 (7nm level). Intel 4 is the first case of the application of Extreme Ultraviolet (EUV) in Intel technology. According to IC Knowledge, an institution specializing in reverse engineering, the performance of Intel 4 process products is superior to TSMC's 5nm process and similar to the existing 3nm process.
On August 22nd, in a collective interview held in Penang, Malaysia, William Grimm, Director (Vice President) of Intel Logic Technology and Development Product Engineering, stated, "Through EUV, we can control process complexity
Intel 4 is the first case of EUV application in Intel technology, and the Meteor Lake CPU Tile planned to be released in September this year is a product produced through Intel 4. The industry expects that due to the late launch of EUVs compared to competitors, there will be issues such as yield.
Regarding the performance comparison with competing foundries, William Grimm stated that "we have designed our own PPA (performance, power consumption, area) based on external benchmarks" and stated that "it is difficult to compare Intel 4 with existing nodes in other foundries
According to reverse engineering company IC Knowledge, the performance of the Intel 4 process is similar to Samsung Electronics 3nm and TSMC 3nm. This means that the transistor integration is higher than other companies' 3nm processes. Intel has previously criticized that the process name is different from the actual transistor length of the semiconductor.
William Grimm introduced that the Intel 4 node is a process that places special emphasis on power efficiency. He explained, "If the Intel 7 process is focused on maximizing performance, then this Intel 4 is focused on improving power efficiency and is suitable for applications such as laptops
Finally, William Grimm stated that "there is sufficient guarantee of (EUV production capacity) to meet market demand", and "plans for the next few years, such as Intel 3, have been determined." Intel 3 will adopt the 4nm process and is scheduled to be released in the second half of this year.
Intel 4 is the first case of EUV application in Intel technology, and the Meteor Lake CPU Tile planned to be released in September this year is a product produced through Intel 4. The industry expects that due to the late launch of EUVs compared to competitors, there will be issues such as yield.
Regarding the performance comparison with competing foundries, William Grimm stated that "we have designed our own PPA (performance, power consumption, area) based on external benchmarks" and stated that "it is difficult to compare Intel 4 with existing nodes in other foundries
According to reverse engineering company IC Knowledge, the performance of the Intel 4 process is similar to Samsung Electronics 3nm and TSMC 3nm. This means that the transistor integration is higher than other companies' 3nm processes. Intel has previously criticized that the process name is different from the actual transistor length of the semiconductor.
William Grimm introduced that the Intel 4 node is a process that places special emphasis on power efficiency. He explained, "If the Intel 7 process is focused on maximizing performance, then this Intel 4 is focused on improving power efficiency and is suitable for applications such as laptops
Finally, William Grimm stated that "there is sufficient guarantee of (EUV production capacity) to meet market demand", and "plans for the next few years, such as Intel 3, have been determined." Intel 3 will adopt the 4nm process and is scheduled to be released in the second half of this year.