Intel completes the assembly of the first commercial high numerical aperture EUV lithography machine
Semiconductor giant Intel announced on the 18th that it has completed the assembly of the industry's first commercial High Numerical Aperture Extreme Ultraviolet (High-NA EUV) lithography machine at its research and development center in Oregon.
Semiconductor equipment manufacturer ASML posted pictures on social platform X at the end of last year, showing the start of shipping the main parts of the first high numerical aperture EUV system to Intel. Now Intel has announced that it has completed assembly, demonstrating a clear intention to lead its competitors.
After developing 5 process nodes in 4 years and expecting the most advanced to reach Intel 18A process, Intel plans to officially introduce the use of high numerical aperture EUV in its Intel 14A process in the future. According to analyst estimates, the price of this high numerical aperture EUV device was approximately 250 million euros.
Intel recently revealed that it will develop the 14A process and the Intel 14A-E process before 2027.
Intel emphasizes that the high numerical aperture EUV device TWINSCAN EXE: 5000 is currently undergoing calibration, and this device, combined with other technologies within the company's wafer factory, is expected to produce features 1.7 times smaller than existing EUV devices.
Meanwhile, Intel mentioned that the company has also planned to purchase the next generation TWINSCAN EXE: 5200B system in the future.
After developing 5 process nodes in 4 years and expecting the most advanced to reach Intel 18A process, Intel plans to officially introduce the use of high numerical aperture EUV in its Intel 14A process in the future. According to analyst estimates, the price of this high numerical aperture EUV device was approximately 250 million euros.
Intel recently revealed that it will develop the 14A process and the Intel 14A-E process before 2027.
Intel emphasizes that the high numerical aperture EUV device TWINSCAN EXE: 5000 is currently undergoing calibration, and this device, combined with other technologies within the company's wafer factory, is expected to produce features 1.7 times smaller than existing EUV devices.
Meanwhile, Intel mentioned that the company has also planned to purchase the next generation TWINSCAN EXE: 5200B system in the future.