Institution: Driven by AI, sales of Japanese chip equipment are expected to increase by 15% in the 2024 fiscal year
According to the Japan Semiconductor Industry Association, thanks to the growth of memory capacity driven by artificial intelligence (AI) and the increase in industry spending, it is expected that the sales of Japanese chip manufacturing equipment will increase by 15% in the fiscal year 2024 ending in March 2025. The Japan Semiconductor Equipment Association has raised its annual sales forecast from 4.03 trillion yen to 4.25 trillion yen (approximately 26 billion US dollars).
The association stated that investment in logic wafer foundries will increase, and it is expected that Japan's semiconductor equipment sales will increase by another 10% in the fiscal year ending in March 2026, reaching 4.68 trillion yen. In the next year, it will further rise to 5.15 trillion yen.
The continuous growth in demand for artificial intelligence chips and data center construction has driven investment in the semiconductor field. Industry reports indicate that SK Hynix plans to invest a total of $75 billion by 2028, primarily to meet the demand for HBM (High Bandwidth Memory) to support NVIDIA AI acceleration chips. Samsung Electronics also plans to catch up in HBM production.
On July 4th, Toshiko Kawa, President and Chairman of semiconductor equipment manufacturer Tokyo Electronics (TEL), stated that the growth of global AI related investments and the increase in sales in the Chinese market are the reasons for the company's upward adjustment of its future prospects.
However, increasingly tense geopolitical factors are also putting pressure on the semiconductor equipment industry.
The continuous growth in demand for artificial intelligence chips and data center construction has driven investment in the semiconductor field. Industry reports indicate that SK Hynix plans to invest a total of $75 billion by 2028, primarily to meet the demand for HBM (High Bandwidth Memory) to support NVIDIA AI acceleration chips. Samsung Electronics also plans to catch up in HBM production.
On July 4th, Toshiko Kawa, President and Chairman of semiconductor equipment manufacturer Tokyo Electronics (TEL), stated that the growth of global AI related investments and the increase in sales in the Chinese market are the reasons for the company's upward adjustment of its future prospects.
However, increasingly tense geopolitical factors are also putting pressure on the semiconductor equipment industry.