Glass substrate technology innovation leads a new wave in the semiconductor packaging equipment market
With the breakthrough progress of glass substrate technology in the field of semiconductor packaging, it is expected that the demand for related equipment in the market will experience significant growth. Glass substrates are regarded as the preferred material for the next generation of packaging technology due to their excellent physical and chemical properties. This transformation heralds new development opportunities for the semiconductor packaging equipment industry.
Under the trend of advanced packaging, glass substrate or glass core technology is regarded as an important material for the next generation of technology. Although most manufacturers currently believe that the commercialization of glass substrate packaging is still some time away, many Taiwanese equipment manufacturers have taken the lead in developing corresponding technologies and products, hoping to further participate in future business opportunities.
Industry giants including Intel, Samsung, and Hynix have announced that they will actively promote the development of glass substrate technology and expect to see its application in end products by 2026. Industry analysts predict that as glass substrate technology gradually matures, equipment manufacturers will become the biggest beneficiaries. This is mainly because with the introduction of new technological standards, corresponding equipment also needs to be upgraded and renovated. On the one hand, the average selling price (ASP) of new products may be relatively high; On the other hand, if this trend is widely recognized and applied in the future, these device manufacturers will have the opportunity to take the lead in occupying advantageous positions in the supply chain.
The introduction of glass substrate technology, especially in 2.5D/3D wafer level packaging and chip stacking technology, will require more precise packaging equipment to achieve high-density vertical electrical interconnects (TGVs). This not only puts forward higher requirements for machining accuracy, but also poses new technical challenges for electroplating and metallization process equipment.
In the manufacturing process of glass substrates, precision machining steps such as cutting, polishing, and drilling have raised higher standards for related processing equipment. It is expected that the market for glass processing equipment such as laser processing equipment and chemical mechanical polishing (CMP) equipment will usher in a new round of growth.
Meanwhile, the electroplating and metallization processes of glass substrates are key steps in achieving their functionality. With the commercial application of TGV technology, the demand for electroplating equipment and metallization technology will significantly increase, especially for equipment that can achieve high-precision and high aspect ratio through-hole filling.
Industry giants including Intel, Samsung, and Hynix have announced that they will actively promote the development of glass substrate technology and expect to see its application in end products by 2026. Industry analysts predict that as glass substrate technology gradually matures, equipment manufacturers will become the biggest beneficiaries. This is mainly because with the introduction of new technological standards, corresponding equipment also needs to be upgraded and renovated. On the one hand, the average selling price (ASP) of new products may be relatively high; On the other hand, if this trend is widely recognized and applied in the future, these device manufacturers will have the opportunity to take the lead in occupying advantageous positions in the supply chain.
The introduction of glass substrate technology, especially in 2.5D/3D wafer level packaging and chip stacking technology, will require more precise packaging equipment to achieve high-density vertical electrical interconnects (TGVs). This not only puts forward higher requirements for machining accuracy, but also poses new technical challenges for electroplating and metallization process equipment.
In the manufacturing process of glass substrates, precision machining steps such as cutting, polishing, and drilling have raised higher standards for related processing equipment. It is expected that the market for glass processing equipment such as laser processing equipment and chemical mechanical polishing (CMP) equipment will usher in a new round of growth.
Meanwhile, the electroplating and metallization processes of glass substrates are key steps in achieving their functionality. With the commercial application of TGV technology, the demand for electroplating equipment and metallization technology will significantly increase, especially for equipment that can achieve high-precision and high aspect ratio through-hole filling.