After the archaeological excavation issues were resolved, TSMC was approved to accelerate the construction of the Chiayi CoWoS advanced packaging plant
TSMC is building two CoWoS advanced packaging plants in the Chiayi Science Park. At the beginning of this summer, construction was suspended due to the discovery of suspected relics. It is reported that Taiwan, China allowed TSMC to continue the construction of AP7 Phase I and AP7 Phase II after solving the problems related to on-site excavation and environmental impact assessment (EIA) archaeological excavation.
In late May this year, during the construction of AP7 Phase I of Advanced Packaging Plant in Chiayi Science Park, Taiwan, China, China, suspected historical sites were found, and the project was suspended according to the Cultural Heritage Protection Law. TSMC has agreed to commence construction of AP7 Phase II, and after review by the Chiayi County Cultural Heritage Committee, the site has been approved for excavation and preservation. At the same time as building the factory, TSMC hired an archaeological company to be responsible for excavation work. To accelerate the excavation progress, the archaeological company quietly recruited 60 workers.
The key part of the latest announcement is that TSMC is advancing the construction of AP7 Phase I and Phase II. The biggest question is whether TSMC will simultaneously build two phases of factories. If it continues to implement this plan, it will greatly increase advanced packaging capacity in a few years, such as Integrated Fan Out (InFO) and CoWoS, which is very beneficial to the industry as TSMC is striving to meet advanced packaging needs.
TSMC's advanced packaging plant AP7 will cost billions of dollars and will be equipped with devices that support advanced backend packaging technologies such as InFO CoWoS. TSMC's CoWoS-S will be used for AMD's Instinct MI250 and Nvidia A100, H100/H200 chips, while CoWoS-L will be used for Nvidia B100/B200 and other next-generation AI and HPC (high-performance computing) application processors. Looking ahead, TSMC's advanced packaging factory AP7 will also support TSMC's SoIC (Integrated Single Chip) packaging method, including front-end 3D stacking technologies such as CoW and WoW, which will enable foundries to assemble vertically stacked products similar to AMD's Instinct MI300.
This archaeological site has significant historical value, dating back to 3500 to 4500 years ago, and is related to the ancient rope patterned pottery culture. This excavation has unearthed various relics such as pottery fragments, pottery rings, ash pits, and shell mounds, which have important cultural and historical value.
All unearthed cultural relics will be temporarily stored by TSMC in the designated area. The further processing of cultural relics will be the responsibility of the Department of Anthropology at National Taiwan University and the Southern Science Park Management Bureau. After the project is completed, the cultural relics will be handed over to the Cultural Bureau of Chiayi County for safekeeping.
The key part of the latest announcement is that TSMC is advancing the construction of AP7 Phase I and Phase II. The biggest question is whether TSMC will simultaneously build two phases of factories. If it continues to implement this plan, it will greatly increase advanced packaging capacity in a few years, such as Integrated Fan Out (InFO) and CoWoS, which is very beneficial to the industry as TSMC is striving to meet advanced packaging needs.
TSMC's advanced packaging plant AP7 will cost billions of dollars and will be equipped with devices that support advanced backend packaging technologies such as InFO CoWoS. TSMC's CoWoS-S will be used for AMD's Instinct MI250 and Nvidia A100, H100/H200 chips, while CoWoS-L will be used for Nvidia B100/B200 and other next-generation AI and HPC (high-performance computing) application processors. Looking ahead, TSMC's advanced packaging factory AP7 will also support TSMC's SoIC (Integrated Single Chip) packaging method, including front-end 3D stacking technologies such as CoW and WoW, which will enable foundries to assemble vertically stacked products similar to AMD's Instinct MI300.
This archaeological site has significant historical value, dating back to 3500 to 4500 years ago, and is related to the ancient rope patterned pottery culture. This excavation has unearthed various relics such as pottery fragments, pottery rings, ash pits, and shell mounds, which have important cultural and historical value.
All unearthed cultural relics will be temporarily stored by TSMC in the designated area. The further processing of cultural relics will be the responsibility of the Department of Anthropology at National Taiwan University and the Southern Science Park Management Bureau. After the project is completed, the cultural relics will be handed over to the Cultural Bureau of Chiayi County for safekeeping.