Advanced chips of TSMC USA still need to be packaged in Taiwan, China, China, and the United States cannot reduce its dependence on the supply chain
According to The Information, many TSMC engineers and former Apple employees said that the advanced chips manufactured by TSMC's Arizona factory for Apple, Nvidia, AMD, Tesla and other important customers still need to be sent to Taiwan, China for advanced packaging. Moreover, TSMC currently has no plans to build packaging plants in Arizona or the United States, with high costs being the main reason.
Last December, Apple CEO Cook and Biden attended the TSMC launch ceremony and stated that the factory would produce chips for Apple. These comments seem to make Apple promise to help Biden achieve its goal of reducing dependence on external chip manufacturing facilities.
According to the report, although the Arizona factory has always been a focus of Biden's plan, which will cost $40 billion to build, it is almost useless for the United States to achieve self-reliance in the chip industry.
Dylan Patel, chief analyst of SemiAnalysi, said, "In the case that all the chips produced have to be sent to Taiwan, China, China for packaging, once the geopolitical trend is tight, the Arizona factory of TSMC may not be a paperweight."
This implies that TSMC's Arizona factory cannot reduce the dependence of the United States on Taiwan, China.
It is reported that the Chip and Science Act provides $52 billion in subsidies, of which at least $2.5 billion is used for advanced packaging and manufacturing programs. Analysts believe that although the United States intends to build multiple advanced packaging facilities based on these proposals, the relatively low amount of packaging subsidies is unlikely to help attract more manufacturers to promote high-cost businesses in the United States.
According to the report, although the Arizona factory has always been a focus of Biden's plan, which will cost $40 billion to build, it is almost useless for the United States to achieve self-reliance in the chip industry.
Dylan Patel, chief analyst of SemiAnalysi, said, "In the case that all the chips produced have to be sent to Taiwan, China, China for packaging, once the geopolitical trend is tight, the Arizona factory of TSMC may not be a paperweight."
This implies that TSMC's Arizona factory cannot reduce the dependence of the United States on Taiwan, China.
It is reported that the Chip and Science Act provides $52 billion in subsidies, of which at least $2.5 billion is used for advanced packaging and manufacturing programs. Analysts believe that although the United States intends to build multiple advanced packaging facilities based on these proposals, the relatively low amount of packaging subsidies is unlikely to help attract more manufacturers to promote high-cost businesses in the United States.