The 10M16DAU324I6G is a remarkable part of Intel's MAX 10 FPGA series, crafted to accommodate a wide range of cost-effective programmable logic needs. With 16,000 logic elements, it provides extensive computational power. Additionally, the device boasts 500 KB of embedded memory and 50 integrated 18 x 18 multipliers, enhancing processing capabilities for various tasks. Enclosed in a "U324" package, it features a 324-pin UBGA configuration, making it suitable for compact designs. The MAX 10 series, including the 10M16DAU324I6G, extends beyond basic functions by offering dual-boot capabilities. This facilitates easy configuration management and seamless updates, which is useful in environments with evolving system demands. This adaptability reduces downtime and prolongs the hardware's lifecycle, aligning well with sustainable practices in hardware management.
Utilizing TSMC's 55 nm Embedded Flash technology, the device provides diverse packaging options offering seamless transitions across different densities, all tailored to a myriad of application requirements. Its incorporation of a 4-input LUT and LAB-arranged LEs fuels exceptional adaptability and optimization for intricate logic operations. Equipped with embedded RAM and M9K memory blocks, it enables expandable RAM options, supporting dual-port and FIFO functionalities.
With accessible non-volatile memory, and a variety of interfaces, the device champions connectivity and ensures data integrity from an emotional perspective. The flexible embedded multiplier blocks operate in various modes, enhancing computational processes with greater zeal. The integrated 12-bit ADC, accommodating up to 17 input channels, provides a canvas for intensive and analog signal processing.
Tailored for compatibility with numerous standards, the advanced clock networks and general-purpose I/Os back high-speed data exchanges. These attributes are supportive of demanding applications, emphasizing reliability where timing matters deeply. Enhanced configuration options include JTAG with AES-128 encryption, which plants seeds of security and data protection for safeguarding sensitive information, stirring the confidence needed in today's world.
Flash memory showcases remarkable data retention, enduring up to 20 years at 85 °C, emphasizing longevity interwoven with reliability. Flexible power supply options, along with dynamic power management features, a commitment to substantial energy efficiency, allowing for practical reductions in operating costs while upholding commendable performance standards.
The 10M16DAU324I6G, with its rich suite of features, stands out as a versatile and efficient solution across a spectrum of electronic applications, blending state-of-the-art technology with practical efficacy, inviting both admiration and trust in its capabilities.
The 10M16DAU324I6G FPGA melds PLD logic, RAM, DSP, ADC, and I/Os into a cohesive unit. This synergy allows it to simplify intricate systems with a focus on energy conservation. Many discover that streamlined systems reduce failure points, easing maintenance tasks and fostering a sense of assurance.
With low power consumption and a sleep mode designed to curb energy use, this FPGA offers notable operational cost savings. Rapid reactivation from sleep mode becomes relevant when dynamic power management is a priority, embodying modern preferences for sustainable and eco-friendly design.
Projected to last 20 years thanks to TSMC's advanced technology, the FPGA provides consistent reliability for long-term projects. Its durability minimizes the need for frequent overhauls, aligning with the budgetary needs of large-scale implementations. This long-term stability meets industry preferences for enduring, cost-conscious solutions.
Supported by Intel's Quartus® Prime Lite and other design resources, others benefit from a smoother design process. These tools reduce development timelines, facilitating swifter market entry. The tool ecosystem inspires creativity and efficiency, which value as they navigate project complexities.
Equipped with dual configuration flash and on-chip ADC, this FPGA increases operational flexibility and efficiency across various settings. These features enable seamless updates and field modifications, fostering adaptability without interruptions. This capability reflects a sophisticated approach to addressing modern design challenges.
Type |
Parameter |
Mounting Type |
Surface Mount |
Surface Mount |
YES |
Operating Temperature |
-40°C-100°C TJ |
Series |
MAX® 10 |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
1.15V-1.25V |
Terminal Form |
BALL |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Total RAM Bits |
562176 |
RoHS Status |
RoHS Compliant |
Package / Case |
324-LFBGA |
Number of I/Os |
246 |
Packaging |
Tray |
Part Status |
Active |
Number of Terminations |
324 |
Terminal Position |
BOTTOM |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
JESD-3D Code |
S-PBGA-B324 |
Number of Logic Elements/Cells |
16000 |
Number of LABs/CLBs |
1000 |
10M16DAU324I6G from the MAX® 10 FPGA series exemplifies a sophisticated integration of programmable logic capabilities that address a broad spectrum of industrial needs. With its comprehensive suite of features, including dual-boot functionality, extensive I/O options, and advanced memory and processing capabilities, this device is tailored for versatility and performance across varied application domains. Its adaptability ensures reduced downtime, enhanced system longevity, and seamless integration, making it an economically viable and efficient solution for contemporary electronic challenges.